Research of spallation and micro—forming of substrate /thin film under laser driven flyer loading
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Jiangsu Provincial Key Laboratory for Science and Technology of Photon Manufacturing, School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China
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Corresponding author:
GAO Chuan-yu, chygao@ujs.edu.cn
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Received Date:
2011-09-13
Accepted Date:
2011-10-17
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Abstract
In order to meet the need of micro forming technology industrialization,a new method,micro-forming spallation delamination micro-forming of substrate/metal thin films under laser driven flyer,was discussed.Combining with laser radiation effect and wave reflection,spallation delamination micro-forming mechanism was expounded.The spallation process of substrate/metal thin film was optimized and strain rate of layers lobes and peak pressure of laser-induced shock wave were estimated according to the principle of conservation of energy.It was found that the spallation of phenomenon of workpieces became apparent with increase of pulse energy,until metal thin films appeared the same structure characteristics as micro-structure of the template,but the substrate remained intact without cracks or deformation.It shows that it's available to achieve spallation and micro-forming of substrate/thin film under laser driven flyer loading.
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Proportional views
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