玻璃材料激光加工技术的研究进展
Research progress of laser processing technology for glass materials
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摘要: 玻璃材料因其优良、独特的理化性能在半导体、微流控芯片、微机电系统、光通讯及光存储等新兴领域有广泛的应用。激光技术作为一种新型非接触加工方法,可以对玻璃材料表面或其内部进行高精度、高效率的微加工,在玻璃材料加工领域展现出巨大潜力。归纳了激光刻蚀、激光打孔、激光焊接及激光制备功能结构4种典型的激光加工玻璃工艺的基本原理及关键问题,指出了玻璃材料激光加工的最新研究进展、工艺水平及应用现状,其中激光刻蚀包括了激光直写刻蚀、激光诱导等离子体刻蚀与激光背部湿法刻蚀; 激光打孔包括了远红外CO2激光打孔、超快激光打孔及改进的打孔方法;激光焊接玻璃工艺包括远红外CO2激光焊接、纳秒激光焊接、超快激光焊接,以及激光制备表面和内部3维功能结构。同时总结了4类激光加工玻璃工艺的优缺点,分析了目前的瓶颈问题。在此基础上,对激光加工玻璃材料的发展前景进行总结和展望。Abstract: Glass materials are widely used in semiconductor, micro-electromechanical system, microfluidic chip, optical communication, optical storage, and other emerging fields due to its excellent and unique physical and chemical properties. As a new non-contact machining method, laser technology can carry out high-precision and high-efficiency micro-machining on the surface and inside of glass materials, which shows great development potential in the field of glass material processing. In this paper, the basic principle and key problems of four typical laser machining glass processes: Laser etching, laser drilling, laser welding, and laser fabrication of functional structures were reviewed. And the latest research progress, technological level, and application status of laser processing of glass materials were pointed out. Laser etching includes laser direct-writing etching, laser-induced plasma-assisted ablation, and laser-induced backside wet etching; laser drilling includes far-infrared CO2 laser drilling, ultrafast laser drilling, and improved new drilling methods; laser welding includes far-infrared CO2 laser welding, nanosecond laser welding, and ultrafast laser welding; while laser fabrication of functional structures was divided into surface functional structures fabrication and internal functional structures fabrication. At the same time the advantages and disadvantages of four kinds of laser machining glass processes were summarized, and the bottleneck problems were analyzed. On this basis, the development prospect of laser processing technology for glass materials is summarized and prospected.
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Key words:
- laser technique /
- glass materials machining /
- ultrafast laser /
- CO2 laser /
- functional structures
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图 1 不同脉冲能量激光烧蚀凹槽及机械抛光后金属线的光学显微图[4]
图 2 激光诱导等离子刻蚀和激光背部湿法刻蚀示意图[5]
a—激光诱导等离子体刻蚀示意图b—激光背部湿法刻蚀示意图
图 3 玻璃表面产生微坑的光学图像[7]
a—在不同入射激光能量密度下b—在不同靶-基材料距离下
图 4 激光诱导等离子体刻蚀工艺传热模型与温度场仿真[8]
a—2维对称瞬态传热模型b—单次激光脉冲后的温度分布
图 5 不同磷酸质量分数吸收剂制备的微通道[10]
图 6 光学显微镜下飞秒激光制孔的截面图[16]
a—130fs激光加工微孔应力分布b—孔出口处损伤
图 7 时间分辨阴影成像光路图及时间延时校准方法[17]
a—时间分辨阴影成像光路图b—石英介质中零延时附近的飞秒激光诱导的等离子通道
图 8 飞秒激光与光纤激光复合微孔加工系统示意图[19]
a—试验平台示意图b—飞秒激光脉冲和光纤激光脉冲的辐照时间
图 9 制孔直径和制孔深度与时间延迟τ的关系及不同τ下飞秒激光与光纤激光结合制孔光学显微图像[19]
a—制孔深度与τ的关系图像b—制孔直径与τ的关系图像c—τ=10μs d—τ=20μs e—τ=30μs f—τ=40μs
图 10 自动控温CO2激光焊接系统及其加工样品示意图[22]
a—基于温度控制的CO2激光焊接系统b—使用玻璃粉末作添加剂的角接石英玻璃
图 11 底部基板涂覆BTS结合剂的焊接样品显微截面图[26]
a—光学显微图b—采用环形闪烁体检测器的SEM显微图
图 12 超短脉冲激光焊接示意图[27]
a—全透明材料焊接b—部分透明材料焊接
图 13 激光焊接样品侧视图[30]
图 14 皮秒激光制备周期性微沟槽及表面液滴实验效果图[37]
a—太阳能玻璃板上不同激光扫描间距下加工出的周期性微沟槽SEM图像b—在水下微结构玻璃板表面上的接触角
图 15 激光改性玻璃表面选择性制备铜导电层加工流程[38]
图 16 在玻璃材料中嵌入波导的制造方案[34]
a—垂直刻写b—平行刻写
图 17 可擦除和重复写入的CsPbBr3量子点发光图案[43]
图 18 液体辅助超快激光钻孔加工原理图[34]
图 19 水辅助超快激光加工微螺旋通道示意图[44]
a—俯视图b—主视图c—全景视图
图 20 超快激光辅助湿法化学刻蚀示意图[34]
a—激光辐照产生潜像b—热处理产生改性区域c—通过化学刻蚀产生微通道
图 21 a—微流混合工作原理图b—氢氧化物催化键合微流混合器3-D示意图[47]
图 22 加工流程[47]
a—超快激光直写b—湿法化学刻蚀c—氢氧化物催化键合
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