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32×32 Si盖革模式激光焦平面探测器

32×32 Si Geiger-mode laser focal plane detector

  • 摘要: 为了满足350 nm~1100 nm波长范围内远距离及微弱激光3维成像探测的需求,提出了一种规模为32×32的盖革模式硅激光焦平面阵列探测器,它主要由硅雪崩光电二极管阵列、读出电路芯片、微透镜阵列、半导体制冷器、引脚网格阵列壳体等元件组成。硅雪崩光电二极管焦平面阵列采用拉通型N+1-P-2-P+结构,工作在盖革模式下,通过Si片背面抛磨减薄及盲孔刻蚀技术,实现了纤薄光敏区的加工;读出电路采用主动模式淬灭设计,使电路单元的死时间控制在50 ns以内,并利用一种带相移技术的时间数字转换电路优化方案,在满足时间分辨率不大于2 ns的同时,降低了读出电路芯片的功耗。结果表明,在反向过偏电压14 V、工作温度-40 ℃的条件下,该探测器在850 nm的目标波长可实现20.7%的平均光子探测效率与0.59 kHz的平均暗计数率,时间分辨率为1 ns,有效像元率优于97%。该研究为纤薄型背进光Si基激光焦平面探测器的研制提供了参考。

     

    Abstract: A 32×32 Geiger-mode silicon laser focal plane array detector was developed for the long-distance or weak-laser detection of the 3-D imaging system using the wavelength in range of 350 nm~1100 nm. This detector is mainly composed of silicon avalanche photodiode array, readout circuit chips, microlens arrays, semiconductor refrigerators, and pin-grid array shells. The silicon avalanche photodiode focal plane arrays, adopts the structure of pull through N+1-P-2-P+ and works at the Geiger mode. The processing of thin photosensitive areas has been achieved through Si wafer back polishing and blind hole etching technology. An active-quenching-mode design was adopted to control the dead time of the circuit unit within 50 ns. An optimized time-to-digital converter circuit scheme with phase shift technology was used to achieve a time resolution within 2 ns while reducing the power consumption of the readout circuit chip. The results show that under the conditions of reverse bias voltage of 14 V and operating temperature of -40 ℃, the detector can achieve an average photon detection efficiency of 20.7% and an average dark counting rate of 0.59 kHz at the target wavelength of 850 nm, with a time resolution of 1 ns and an effective pixel rate better than 97%. This study provides a reference for the development of thin-type back-illuminated silicon-based laser focal plane detectors.

     

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