Citation: | XIE Xiao-zhu, WEI Xin, HU Wei. Effect of linear polarized CO2 lasers on cut kerfs of nonmetallic material[J]. LASER TECHNOLOGY, 2008, 32(4): 399-401,416. |
[1] |
CAO H,SONG L K,PENG H D,et al.The study of the relationship between polarized light's incident azimuth and intermediary reflectance[J].Laser Technology,2005,29(1):104-105(in Chinese).
|
[2] |
WALLACE R J,BASS M,COPLEY S M.Curvature of laser-machined grooves in Si3N4[J].J A P,1986,59(15):3555-3560.
|
[3] |
OLSEN F O.Cutting with polarized laser beams[J].DVS-Berichte,1980,63:197-200.
|
[4] |
van HALEWIJN H J.The industrial laser handbook[M].New York:Springer-Verlag,1992:108-112.
|
[5] |
SCHREINER-MOHR U,DAUSINGER F,HU GEL H.New aspects of cutting with CO2 lasers[C]//ICALEO'91.San José:Laser Institute of America,1991:263-271.
|
[6] |
NIZIEV V G,NESTEROV A V.Influence of beam polarization on laser cutting efficiency[J].Journal of Physics,1999,31(13):1455-1461.
|
[7] |
TREYZ G V,BEACH R,OSGOOD R M,Jr.Rapid direct writing of high-aspect-ratio trenches in silicon[J].A P L,1987,50(8):475-477.
|
[8] |
BONSE J,RUDOLPH P,KRUGER J,et al.Femtosecond pulse laserprocessing of TiN on silicon[J].Applied Surface Science,2000(154):659-663.
|
[9] |
BONSE J,GEUSS M,BAUDACH S,et al.The precision of the femtosecond-pulse laser ablation of TiN films on silicon[J].Appl Phys,1999,A69(7):S399-S402.
|
[10] |
ToENSHOFF H K,OSTENDORF A,WAGNER T.Structuring silicon with femtosecond lasers[J].SPIE,2001,4274:88-97.
|
1. |
谭芳喜,肖世德,李晟尧,周亮君. 基于密集特征匹配的数字图像相关法. 激光与光电子学进展. 2021(16): 390-398 .
![]() | |
2. |
俞海,刘云鹏,郭荣鑫,夏海廷,颜峰. 数字图像相关法散斑图质量评价方法. 激光技术. 2020(02): 237-243 .
![]() | |
3. |
曹国强,刘禹廷,王琳霖. 改进非下采样轮廓波在散斑条纹中的滤波处理. 激光技术. 2019(02): 269-274 .
![]() | |
4. |
庞亮,孟雪井. 遗传优化神经网络的激光散斑数据建模与分析. 激光杂志. 2018(09): 148-151 .
![]() |