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Volume 28 Issue 2
Sep.  2013
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Article Navigation >  LASER TECHNOLOGY  > 2004 >  28(2): 162-165

Citation:
shu

Simulation and verification of the temperature field in laser hardening

  • 1.

    Faculty of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;

  • 2.

    Institute of Mechanics, the Chinese Academy of Sciences, Beijing 100080, China

  • Received Date: 2003-05-06
    Accepted Date: 2003-09-28
  • We introduce the external-cavity semiconductor laser with feedback of Littrow configuration. The spectral line width is narrowed to be less than 1.2MHz and the output stability is remarkably enhanced. We also propose a new complex-cavity method which can greatly narrow the line width of a semiconductor laser.
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  • [1] 王秀凤.激光非熔凝加工技术在板料成形中的应用.北京:北京航空航天大学机械工程及自动化学院,2003.88～115.
    [2] 谭真,郭广文.工程合金热物性.北京:冶金工业出版社,1994.9.
    [3] 季忠,吴诗淳,李淼泉.塑性工程学报,1997(2):14～18.
    [4] 刘顺洪,万鹏腾,胡良果 et al.电焊机,2001(8):16～19.
    [5] 姜任秋.热传导、质扩散与动量传递中的瞬态冲击效应.北京:科学出版社,1997.2.
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  • 1. 

    沈阳化工大学材料科学与工程学院 沈阳 110142

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Simulation and verification of the temperature field in laser hardening

  • 1. Faculty of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;
  • 2. Institute of Mechanics, the Chinese Academy of Sciences, Beijing 100080, China
  • Received Date: 2003-05-06
  • Accepted Date: 2003-09-28
  • Available Online: 2004-03-25

Abstract: We introduce the external-cavity semiconductor laser with feedback of Littrow configuration. The spectral line width is narrowed to be less than 1.2MHz and the output stability is remarkably enhanced. We also propose a new complex-cavity method which can greatly narrow the line width of a semiconductor laser.

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