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Volume 28 Issue 2
Sep.  2013
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Article Navigation >  LASER TECHNOLOGY  > 2004 >  28(2): 131-132,143

Citation:
shu

Microcutting Si wafer in water bath by second harmonic output of YAG laser

  • 1.

    Shanghai Institute of Optics and Fine Mechanics, the Chinese Academy of Sciences, Shanghai 201800, China

  • Received Date: 2003-06-18
    Accepted Date: 2003-07-22
  • The results are reported that the splashes of microcutting Si wafer by second harmonic output of YAG laser in water bath may be fewer than in air environment.The surface morphology and etching rate for water bath and air environment are compared in detail.The cutting gap as small as 50μm with edge fluctuation less than 5μm is obtained in water bath.This technology may be helpful for industrial applications.
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    GOWER M C.SPIE,1998,3343:171.
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    ZHANG J,SUGIOKA K,MIDORIKAWA K.Appl Phys,1998,A67:499～501.
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    PEYRE P,FABBRO R,BERTHE L et al.Journal of Laser Appli-cations,1996(8):135～141.
    [4] 黄杰译.激光与光电子学进展,2002(6):18～20.
    [5] 杨遇春.激光与红外,1997,27(6):326～329.
    [6] 杨逸民.激光与红外,1997,27(6):333～336.
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  • 1. 

    沈阳化工大学材料科学与工程学院 沈阳 110142

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Microcutting Si wafer in water bath by second harmonic output of YAG laser

  • 1. Shanghai Institute of Optics and Fine Mechanics, the Chinese Academy of Sciences, Shanghai 201800, China
  • Received Date: 2003-06-18
  • Accepted Date: 2003-07-22
  • Available Online: 2004-03-25

Abstract: The results are reported that the splashes of microcutting Si wafer by second harmonic output of YAG laser in water bath may be fewer than in air environment.The surface morphology and etching rate for water bath and air environment are compared in detail.The cutting gap as small as 50μm with edge fluctuation less than 5μm is obtained in water bath.This technology may be helpful for industrial applications.

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