Microcutting Si wafer in water bath by second harmonic output of YAG laser

The results are reported that the splashes of microcutting Si wafer by second harmonic output of YAG laser in water bath may be fewer than in air environment.The surface morphology and etching rate for water bath and air environment are compared in detail.The cutting gap as small as 50μm with edge fluctuation less than 5μm is obtained in water bath.This technology may be helpful for industrial applications.