Experimental research on Si cutting by using UV excimer laser

Lou Qihong; Zhang Lin; Ye Zhenhuan; Dong Jingxing; Wei Yunrong

Lou Qihong, Zhang Lin, Ye Zhenhuan, Dong Jingxing, Wei Yunrong. Experimental research on Si cutting by using UV excimer laser[J]. LASER TECHNOLOGY, 2002, 26(4): 250-251,254.

Citation:

Lou Qihong, Zhang Lin, Ye Zhenhuan, Dong Jingxing, Wei Yunrong. Experimental research on Si cutting by using UV excimer laser[J]. LASER TECHNOLOGY, 2002, 26(4): 250-251,254.

Citation:

Lou Qihong, Zhang Lin, Ye Zhenhuan, Dong Jingxing, Wei Yunrong. Experimental research on Si cutting by using UV excimer laser[J]. LASER TECHNOLOGY, 2002, 26(4): 250-251,254.

Experimental research on Si cutting by using UV excimer laser

Graphical Abstract

Graphical Abstract

Abstract

Abstract

In this paper,the experimental results of Si wafer cutting by 193nm excimer laser are reported.By using cylinder focus system and "thermal-splits" technique,less than 15μm cutting gap with 5μm fluctuation of cutting edge are obtained.