Research on microchannel of silica glass fabricated by laser-induced backside wet etching
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摘要: 为了获得飞秒激光背部湿刻石英玻璃微通道的最佳参量，通过分别改变飞秒激光的功率、刻蚀速率和显微物镜的放大倍数进行了实验。采用超景深显微镜对加工样品进行观察和测量，并分析了微通道的形貌。结果表明，在飞秒激光功率为50mW、刻蚀速率为0.010mm/s、20×显微物镜聚焦的实验条件下，可以制备出深度为1466μm、深宽比为32的石英玻璃微通道。此研究对3维结构维纳制造技术有一定的应用价值。Abstract: In order to achieve the optimum parameters of laser-induced backside wet etching for the fabrication of microchannel of silica glass, experiments were made by changing the laser power, etching velocity and magnification times of microscope objective. The processing samples were observed and measured by digital microscope. And then, the topography of microchannels was analyzed. The results show that, under the experimental conditions of laser power of 50mW, etching velocity of 0.010mm/s and 20× microscope objective lens, microchannels of silica glass were fabricated with the depth of 1466μm and the ratio of depth to width of 32. This research has certain application value for micronano fabrication technology of 3-D structure.
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Keywords:
- ultrafast optics /
- microchannel /
- laser-induced backside wet etching /
- silica glass
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Figure 1. a—experimental setup for laser processing b—bottom surface of silica glass c—side surface of silica glass
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