高级检索

水射流激光复合刻蚀陶瓷的研究

谢兵兵, 袁根福

谢兵兵, 袁根福. 水射流激光复合刻蚀陶瓷的研究[J]. 激光技术, 2016, 40(5): 762-766. DOI: 10.7510/jgjs.issn.1001-3806.2016.05.030
引用本文: 谢兵兵, 袁根福. 水射流激光复合刻蚀陶瓷的研究[J]. 激光技术, 2016, 40(5): 762-766. DOI: 10.7510/jgjs.issn.1001-3806.2016.05.030
XIE Bingbing, YUAN Genfu. Research of water jet-laser complex etching of ceramics[J]. LASER TECHNOLOGY, 2016, 40(5): 762-766. DOI: 10.7510/jgjs.issn.1001-3806.2016.05.030
Citation: XIE Bingbing, YUAN Genfu. Research of water jet-laser complex etching of ceramics[J]. LASER TECHNOLOGY, 2016, 40(5): 762-766. DOI: 10.7510/jgjs.issn.1001-3806.2016.05.030

水射流激光复合刻蚀陶瓷的研究

基金项目: 

国家自然科学基金资助项目(51175229)

详细信息
    作者简介:

    谢兵兵(1989-),男,硕士研究生,现主要从事激光精密加工方面的研究。

    通讯作者:

    袁根福,E-mail:forygf@263.net

  • 中图分类号: TN249

Research of water jet-laser complex etching of ceramics

  • 摘要: 为了改善激光直接刻蚀过程中形貌普遍较差的问题,采用水射流激光复合刻蚀的方法,以SiC复相陶瓷和Al2O3陶瓷为研究材料,分析了有无水射流条件下的形貌差异以及不同成分陶瓷的形貌差异,并在此基础上研究了水射流流速对刻蚀深度和蚀除量的影响。结果表明,直接刻蚀时,大量熔渣附于刻蚀表面,刻蚀形貌较差,SiC复相陶瓷60%以上直接气化分解,熔渣较少,形貌稍好于Al2O3陶瓷;复合刻蚀时,刻蚀形貌有所变好,且水射流流速在24m/s时的形貌要好于16m/s时的;水射流流速越大,材料的刻蚀深度和蚀除量越小,流速每增大2m/s时,材料的蚀除量平均减少0.066mm3左右,相同流速下,SiC复相陶瓷的蚀除量比Al2O3陶瓷大0.4mm3左右。此研究对提高刻蚀形貌和分析不同陶瓷的刻蚀机理是有帮助的。
    Abstract: In order to improve the problems that the bad morphologies are very bad in the process of laser direct etching, the method of water jet-laser complex etching was adopted. With SiC composite ceramics and Al2O3 ceramics as studying object materials, the etched morphologies of different componential ceramics with or without water jet were analyzed. On this basis, the effects of velocity of water jet on the etched depth and removal amount were studied. The results show that in the process of laser direct etching, a large amount of slag is attached to the etched surface, the etched morphologies are very bad, more than 60% of SiC composite ceramics are directly decomposed, the slag is less, so the morphology is better than Al2O3 ceramics slightly. In the process of water jet-laser complex etching, the etched morphologies are both turned better, and the morphology when velocity of water jet is 24m/s is better than that when 16m/s. The velocity of water jet is bigger, the etched depth and removal amount are smaller. The velocity of water jet increases every 2m/s, the removal amount reduces by an average of about 0.066mm3. In the case of the same velocity of water jet, the removal amount of SiC composite ceramics is about 0.4mm3, bigger than Al2O3 ceramics. This study is helpful to improve the etched morphologies and analyze the etched mechanism of different ceramics.
  • [1]

    ZHANG X H,AN Y M,HAN J C,et al.Graphene nanosheet reinforced ZrB2-SiC ceramic composite by thermal reduction of graphene oxide[J].RSC Advances,2015,5(58):47060-47065.

    [2]

    XIE Y P,CHENG L F,MEI H,et al.Effect of SiC Particles on mechanical properties of laminated (SiCw+SiCp)/SiC ceramic composites[J].International Journal of Applied Ceramic Technology,2015,12(3):535-541.

    [3]

    JING Y N,DENG X Y,LI J B,et al.Fabrication and properties of SiC/mullite composite porous ceramics[J].Ceramics International,2014,40(8):1329-1334.

    [4]

    RAK Z S.A process for Cf/SiC composites using liquid polymer infiltration[J].Journal of the American Ceramic Society,2001,84(10):2235-2239.

    [5]

    WU X F,WANG Y,ZHANG H Z.Experimental research on laser assisted machining of Silicon Nitride ceramics[J].Journal of Astronautics,2010,31(5):1457-1462(in Chinese).

    [6]

    ZHANG X F,YU G Q,JIANG L W.Application of alumina ceramic[J].Foshan Ceramic,2010,20(2):38-43(in Chinese).

    [7]

    YUAN G F,ZENG X Y.Laser forming research on brittle inorganic materials and the application status[J].LaserOptoelectronics Progress,2002,39(6):47-51(in Chinese).

    [8]

    LING L,LOU Q H,LI S Z,et al.Microcutting Si wafer in water bath by second harmonic output of YAG laser[J].Laser Technology,2004,28(2):132-134(in Chinese).

    [9]

    YUAN G F,YAO Y S,CHEN X H,et al.Experimental study on the quality of material surface applied laser-chemical combined etching[J].Chinese Journal of Lasers,2010,37(1):281-283(in Chinese).

    [10]

    VASS C,OSVAY K,CSETE M,et al.Fabrication of 550nm gratings in fused silica by laser induced backside wet etching technique[J].Applied Surface Science,2007,253(19):8059-8063.

    [11]

    QIAO Ch R.Development of EDM/Laser compound precision fine machining system[J].Manufacturing TechnologyMachine Tool,2004,17(2):46-50(in Chinese).

    [12]

    KONG L R,ZHANG F,DUAN J,et al.Research of water-assisted laser etching of alumina ceramics[J].Laser Technology,2014,38(3):330-334(in Chinese).

    [13]

    LONG Y H,XIONG L C,SHI T L.Experimental research of micromachining silicon by excimer laser ablation in air and under water[J].Laser Technology,2006,30(6):567-569(in Chinese).

    [14]

    TAN Y L.Water jet guided laser technology[J].Superhard Material Gineering,2013,25(3):47-50(in Chinese).

    [15]

    PORTER J A,LOUHISALMI A,KARJALAINEN J A,et al.Cutting thin sheet metal with a water jet guided laser using various cutting distances,feed speeds and angles of incidence[J].The International Journal of Advanced Manufacturing Technology,2007,33(9/10):961-967.

计量
  • 文章访问数:  3
  • HTML全文浏览量:  0
  • PDF下载量:  5
  • 被引次数: 0
出版历程
  • 收稿日期:  2015-06-17
  • 修回日期:  2015-07-19
  • 发布日期:  2016-09-24

目录

    /

    返回文章
    返回