Laser-assisted glass frit bonding in air and vacuum
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摘要: 为了验证真空环境对玻璃激光焊接气孔形成的影响,采用在大气及真空条件下进行玻璃激光焊接对比试验的方法,对两种条件下气孔率随激光功率的变化及玻璃料向两端扩展的程度进行了理论分析和实验验证。结果表明,气孔的成因不仅是玻璃料中残存的气体,功率提高至45W后,不稳定成分的升华与分解产生了更多气体,进一步提高了气孔率; 真空条件对焊缝扩展影响较小,无明显差异;而真空条件下的气孔率要显著大于在大气条件下的气孔率; 真空条件下气孔面积更大,但增大的气孔面积并不能扩大玻璃料的扩展宽度。该研究结果进一步地揭示了玻璃激光焊接下气孔的形成机制。Abstract: In order to verify the effect of vacuum environment on the formation of pores in glass laser welding, the comparative test of glass laser welding under atmospheric and vacuum conditions was adopted.Theoretically analyze and experimentally verify of the change of porosity with laser power and the extent of expansion of glass frit to both ends under the two conditions was then carried out. The results show that, the cause of the porosity is not only the residual gas in the glass frit, but also the sublimation and decomposition of unstable components to produce more gas after the power is increased to 45W, which further improves the pores. It is found that the vacuum condition has little effect on the bonding expansion, and there is no obvious difference. The porosity under vacuum condition is significantly greater than that under atmospheric condition. The porosity is larger under vacuum condition, but the enlargement of porosity can't enlarge the expansion width of glass frit. The results further reveal the formation mechanism of pores under laser-assisted glass frit bonding.
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Keywords:
- laser technique /
- pores /
- laser bonding /
- vacuum /
- glass
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Table 1 Thermal properties of material used in the study
material transition temperature/℃ softening point/℃ coefficient of thermal expansion/ (10-7 ℃-1) glass substrate 722 971 31.7 glass frit 343 428 48 Table 2 Bonding parameters
number laser power P/W welding speed v/ (m·min-1) defocusing amount D/mm 1 37 0.1 -15 2 40 0.1 -15 3 45 0.1 -15 4 50 0.1 -15 5 55 0.1 -15 6 60 0.1 -15 -
[1] CRUZ R, da CRUZ R J A, MAÇAIRA J, et al. Glass-glass laser-assisted glass frit bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(12): 1949-1956. DOI: 10.1109/TCPMT.2012.2212195
[2] WU Q, LORENZ N, KEVIN M. Glass frit as a hermetic joining layer in laser based joining of miniature devices[J]. IEEE Transactions on Components and Packaging Technologies, 2010, 33(2): 470-477. DOI: 10.1109/TCAPT.2010.2045000
[3] CHEN G Y, HE J, ZHONG P X, et al. Study on the porosity control during laser welding of glass[J]. Laser Technology, 2021, 45(3): 286-291(in Chinese).
[4] SU Sh X, YU Y L, FEI W, et al. Research of characteristics of weld formation of aluminum alloy by high power fiber laser welding[J]. Laser Technology, 2017, 41(3): 322-327 (in Chinese). http://en.cnki.com.cn/Article_en/CJFDTOTAL-JGJS201703004.htm
[5] BARDIN F, KLOSS S, WANG Ch H, et al. Laser bonding of glass to silicon using polymer for microsystems packaging[J]. Journal of Microelectromechanical Systems, 2007, 16(3): 571-580. DOI: 10.1109/JMEMS.2007.896704
[6] RIBEIRO F, MACAIRA J, CRUZ R, et al. Laser assisted glass frit sealing of dye-sensitized solar cells[J]. Solar Energy Materials and Solar Cells, 2012, 96: 43-49. DOI: 10.1016/j.solmat.2011.09.009
[7] TAO W, MA Y A, CHEN Y B, et al. The influence of adhesive viscosity and elastic modulus on laser spot weld bonding process[J]. International Journal of Adhesion and Adhesives, 2014, 51: 111-116. DOI: 10.1016/j.ijadhadh.2013.12.003
[8] HUANG M H, ZHANG Q M, LV Q T, et al. UV-laser welding process of copper-plated glass[J]. Chinese Journal of Lasers, 2020, 47(10): 1002007(in Chinese). DOI: 10.3788/CJL202047.1002007
[9] XIAO Y Y, WANG W, WU X Y, et al. Process design based on temperature field control for reducing the thermal residual stress in glass/glass laser bonding[J]. Optics & Laser Technology, 2017, 91: 85-91. DOI: 10.1016/j.optlastec.2016.12.016
[10] PANG J W, WANG Ch, CAI Y K. Research progress of laser processing technology for glass materials[J]. Laser Technology, 2021, 45(4): 417-428(in Chinese).
[11] FU K, LI Y, YIN L Q, et al. Effect of CuO on laser absorption in glass to glass laser bonding[C]//2014 15th International Conference on Electronic Packaging Technology. New York, USA: IEEE, 2014: 484-488.
[12] TIAN R, YIN L Q, LI Y, et al. The effect of glass frit paste levelling property on encapsulation[C]//2018 19th International Conference on Electronic Packaging Technology (ICEPT). New York, USA: IEEE, 2018: 1097-1101.
[13] FU X L, TIAN R, LI Y, et al. Laser bonding of glass and glass with constant temperature output[C]//2018 19th International Confe-rence on Electronic Packaging Technology (ICEPT). New York, USA: IEEE, 2018: 1084-1088.
[14] KIND H, GEHLEN E, ADEN M, et al. Laser glass frit sealing for encapsulation of vacuum insulation glasses[J]. Physics Procedia, 2014, 56: 673-680. DOI: 10.1016/j.phpro.2014.08.075
[15] BEDJAOUI M, AMIRAN J, BRUN J. Ultrathin glass to ultrathin glass bonding using laser sealing approach[C]//2019 IEEE 69th Electronic Components and Technology Conference (ECTC). New York, USA: IEEE, 2019: 995-1001.
[16] EMAMI S, MARTINS J, ANDRADE L, et al. Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates[J]. Optics and Lasers in Engineering, 2017, 96: 107-116. DOI: 10.1016/j.optlaseng.2017.04.006
[17] PENG G Sh. Laser welding characteristics of aluminum and nickel-base alloys under vacuum environment[D]. Harbin: Harbin Institute of Technology, 2015: 48-54 (in Chinese).
[18] MIAO H, HE Q, ZHANG Sh W, et al. Study on pores control of va-cuum plate glazing by laser sealing[J]. Laser Technology, 2019, 43(1): 38-42 (in Chinese). http://en.cnki.com.cn/Article_en/CJFDTotal-JGJS201901008.htm
[19] LIU Y F, CHEN D E, LIN L W, et al. Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure[J]. Journal of Laser Micro Nanoengineering, 2016, 26: 035018. DOI: 10.1088/0960-1317/26/3/035018
[20] LORENZ N, MILLAR S, DESMULLIEZ M, et al. Hermetic glass frit packaging in air and vacuum with localized laser joining[J]. Journal of Laser Micro Nanoengineering, 2011, 21: 045039.