半导体晶圆激光切割新技术

黄福民; 谢小柱; 魏昕; 胡伟; 苑学瑞

半导体晶圆激光切割新技术

1.
广东工业大学机电工程学院广州 510006

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术..

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn ;

基金项目:
国家自然科学基金资助项目(50805027)
中图分类号: TG485

Newly developed techniques for laser dicing wafer

1.
Faculty of Eletromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn ;

CLC number: TG485

摘要: 激光切割半导体晶圆具有切槽窄、非接触式加工和加工速度快等特点,但仍然存在材料重凝、热影响区较大和易产生裂纹等问题。为了解决这些问题,分析了问题的成因,并分别从激光器、光学系统和加工介质3个方面详细介绍了一些新型半导体晶圆激光切割技术,阐述其基本原理,分析其优缺点及主要应用和研究领域,为进一步研究和工业化应用提供了技术参考。
- 激光技术 /
- 激光切割 /
- 半导体晶圆 /
- 影响因素 /
- 激光器
Abstract: Laser dicing semiconductor wafer has advantages of narrow kerf,non-contact processing and high dicing velocity etc.However,there still exist some problems,such as redeposition of melting material,large heat affected zone and cracking easily.In order to overcome these problems,the causes were analyzed and a series of newly-developed methods were introduced in detail from three aspects,i.e.,lasers,optical systems and processing mediums.Simultaneously,the basic principles were described.Furthermore,advantages,disadvantages and applications of laser dicing technique were analyzed,which provides valuable technical references for further research and industrial applications.
- laser technique /
- laser dicing /
- semiconductor wafer /
- influencing factors /
- lasers

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半导体晶圆激光切割新技术

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术..

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn ;

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn ;

计量

半导体晶圆激光切割新技术

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn;

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术.

English Abstract

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn

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留言板

半导体晶圆激光切割新技术

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术..

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn ;

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn ;

计量

出版历程

半导体晶圆激光切割新技术

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn;

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术.

English Abstract

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn

全文HTML

目录