Abstract: Laser dicing semiconductor wafer has advantages of narrow kerf,non-contact processing and high dicing velocity etc.However,there still exist some problems,such as redeposition of melting material,large heat affected zone and cracking easily.In order to overcome these problems,the causes were analyzed and a series of newly-developed methods were introduced in detail from three aspects,i.e.,lasers,optical systems and processing mediums.Simultaneously,the basic principles were described.Furthermore,advantages,disadvantages and applications of laser dicing technique were analyzed,which provides valuable technical references for further research and industrial applications.