模具半导体激光强韧化工艺研究
Process research of diode laser surface hardening for dies
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摘要: 为了研究模具材料半导体激光表面强韧化工艺,采用半导体激光表面淬火工艺,进行了7CrSiMnMoV,Cr12MoV,CrMo铸铁等典型模具材料半导体激光淬火的工艺研究,得到了不同模具材料优化的激光工艺参量。结果表明,激光表面淬火后的硬度满足模具材料的使用要求。这一结果为激光模具表面强韧化处理提供了可靠的保障。Abstract: In order to improve the surface hardness and toughness of dies,several typical die materials,such as 7CrSiMnMoV,Cr12MoV,CrMo cast iron,were hardened with a high power diode laser and the optimal laser parameters were obtained.Results show that the optimal laser parameters can meet the requirement of the hardness of dies and provide a guarantee to the hardness and toughness of dies in future application.
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