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模具半导体激光强韧化工艺研究

闵大勇, 王爱华, 熊志红, 卢飞星

闵大勇, 王爱华, 熊志红, 卢飞星. 模具半导体激光强韧化工艺研究[J]. 激光技术, 2012, 36(3): 364-367.
引用本文: 闵大勇, 王爱华, 熊志红, 卢飞星. 模具半导体激光强韧化工艺研究[J]. 激光技术, 2012, 36(3): 364-367.
MIN Da-yong, WANG Ai-hua1, XIONG Zhi-hong, LU Fei-xing. Process research of diode laser surface hardening for dies[J]. LASER TECHNOLOGY, 2012, 36(3): 364-367.
Citation: MIN Da-yong, WANG Ai-hua1, XIONG Zhi-hong, LU Fei-xing. Process research of diode laser surface hardening for dies[J]. LASER TECHNOLOGY, 2012, 36(3): 364-367.

模具半导体激光强韧化工艺研究

详细信息
    作者简介:

    闵大勇(1971- ),男,硕士,现主要从事激光加工装备及工艺的研究.E-mail:mdy@hglaser.com

    通讯作者:

    闵大勇,E-mail:mdy@hglaser.com

  • 中图分类号: TG156.33

Process research of diode laser surface hardening for dies

  • 摘要: 为了研究模具材料半导体激光表面强韧化工艺,采用半导体激光表面淬火工艺,进行了7CrSiMnMoV,Cr12MoV,CrMo铸铁等典型模具材料半导体激光淬火的工艺研究,得到了不同模具材料优化的激光工艺参量。结果表明,激光表面淬火后的硬度满足模具材料的使用要求。这一结果为激光模具表面强韧化处理提供了可靠的保障。
    Abstract: In order to improve the surface hardness and toughness of dies,several typical die materials,such as 7CrSiMnMoV,Cr12MoV,CrMo cast iron,were hardened with a high power diode laser and the optimal laser parameters were obtained.Results show that the optimal laser parameters can meet the requirement of the hardness of dies and provide a guarantee to the hardness and toughness of dies in future application.
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出版历程
  • 收稿日期:  2011-08-03
  • 修回日期:  2011-11-02
  • 发布日期:  2012-05-24

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