双折射晶体厚度干涉测量技术的研究

Novel interferometry measurement technique for birefringence crystal thickness

摘要: 为了能精确测量出晶体厚度,利用晶体的双折射特性,采用剪切干涉法来测量双折射晶体的厚度,从理论上推导出其实现的可行性,并结合实验验证了测量系统的具体实现过程及计算厚度的算法。结果表明,该方法可用来测量厚度为厘米量级的双折射晶体的厚度,测量的均方根误差小于20nm。

Abstract: In order to measure the crystal thickness accurately,a measurement method based on the birefringence characteristics of crystal was proposed and the feasibility was analyzed.Furthermore the realization process of measuring system and arithmetic of calculating thickness was validated by experiments.The experiment result shows that the root mean square of measuring error was less than 20nm.