Effect of linear polarized CO2 lasers on cut kerfs of nonmetallic material
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摘要: 为了研究线偏振CO2激光对高吸收率非金属材料的影响,采用线偏振CO2激光沿着不同的方向切割模切板,研究不同激光功率、切割速度、切割方向、辅助气体对切缝宽度的影响,同时对比线偏振激光切割低碳钢.试验结果表明,改变激光功率和切割速度对模切板进行切割,上、下切缝沿不同方向之间的宽度相差不大,即偏振性对高吸收率非金属材料模切板的切缝影响不大,但是对金属材料影响很大.辅助气体N2和空气对上下切缝的影响不大,从经济角度应优先选择空气;为了得到上下均匀一致的切缝,同一激光功率下,切割速度应小些,而同一切割速度下,激光功率应大些.Abstract: Highly absorptive nonmetallic material,die-board,was cut by linear polarized CO2 lasers through eight different directions.Effect of laser power,cutting speed and assisted air on the width of the cut kerfs of the die-board was also discussed by contrast with that of lower carbon steel.The results indicate that the difference between the top and the bottom kerfs width of the die-board along eight directions is not sensitive to linear polarization with altering laser power and cutting speed,while the kerf width difference of steel is on the contrary.Assisted gas such as N2 and air has little effects on the kerf,therefore air should be selected in view of lower cost.Uniform cut kerfs can be achieved with lower cutting speed under certain laser power or higher laser power at a certain cutting speed.
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Keywords:
- laser technique /
- CO2 laser cutting linear polarized /
- cut kerf /
- die-board
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[1] CAO H,SONG L K,PENG H D,et al.The study of the relationship between polarized light's incident azimuth and intermediary reflectance[J].Laser Technology,2005,29(1):104-105(in Chinese).
[2] WALLACE R J,BASS M,COPLEY S M.Curvature of laser-machined grooves in Si3N4[J].J A P,1986,59(15):3555-3560.
[3] OLSEN F O.Cutting with polarized laser beams[J].DVS-Berichte,1980,63:197-200.
[4] van HALEWIJN H J.The industrial laser handbook[M].New York:Springer-Verlag,1992:108-112.
[5] SCHREINER-MOHR U,DAUSINGER F,HU GEL H.New aspects of cutting with CO2 lasers[C]//ICALEO'91.San José:Laser Institute of America,1991:263-271.
[6] NIZIEV V G,NESTEROV A V.Influence of beam polarization on laser cutting efficiency[J].Journal of Physics,1999,31(13):1455-1461.
[7] TREYZ G V,BEACH R,OSGOOD R M,Jr.Rapid direct writing of high-aspect-ratio trenches in silicon[J].A P L,1987,50(8):475-477.
[8] BONSE J,RUDOLPH P,KRUGER J,et al.Femtosecond pulse laserprocessing of TiN on silicon[J].Applied Surface Science,2000(154):659-663.
[9] BONSE J,GEUSS M,BAUDACH S,et al.The precision of the femtosecond-pulse laser ablation of TiN films on silicon[J].Appl Phys,1999,A69(7):S399-S402.
[10] ToENSHOFF H K,OSTENDORF A,WAGNER T.Structuring silicon with femtosecond lasers[J].SPIE,2001,4274:88-97.
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