Abstract: Laser-induced plasma has shown increasing potential in removing micro-/nano-particles stuck onto the surface of precise components in nano-science and nano-technology. In order to study the removal mechanism of the micro-/nano-particles, silicon surfaces were cleaned by means of nanosecond laser plasma, during which the removal results was observed and then the optimized conditions for laser plasma to flush the silicon surface was recommended. The results show that plasma radiates out wide-spectrum light, whose ultraviolet short wave accelerates the ionization of surrounding air, increases the volume of plasma and increase the temperature of base and particle effectively. Because of thermal expansion difference between the base and particles, the particles are peeled from the base easily. At the same time, the high pressure shock waves up to GPa are formed resulting from the expansion and diffusion of plasma to the surrounding area. It can overcome van Edward force between the particles and the substrate and remove the micro-/nano-particles. Especially, the removal effect of the particle size larger than 0.5μm is more obvious. During the actual removal process, the distance from the plasma to the base should be between 0.2mm and 2mm. The distance can ensure the effective removal of the particles and cause no damage to the base. The effect of laser plasma on the removal of particles is obvious and it is the combined effect of the radiation effect and the shock wave effect of the plasma.