Experimental research of micromachining silicon by excimer laser ablation in air and under water
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摘要: 为了研究脉冲激光在不同介质中的刻蚀特性,采用20ns短脉冲、248nm准分子激光(能量为150mJ~250mJ)分别在水和空气两种介质中对半导体单晶Si片进行微刻蚀实验研究。在实验的基础上,研究了两种介质中准分子激光刻蚀Si的刻蚀孔的基本形貌和刻蚀速率,并对结果进行了对比分析。研究结果表明,水辅助激光微加工时,熔屑易从加工区排出,有助于提高加工的表面质量;同时,水的约束提高了冲击作用,使得刻蚀速率加快。Abstract: To investigate the technique of laser etching silicon under different mediums,micromachining of silicon was conducted using a short-pulse(FWHM is 20ns) KrF excimer laserwith energy of 150mJ~250mJ.Laser etching were tested on a silicon workpiece both in air and under water.Based on the results of experiments,basic etching appearance and etching velocities by excimer laser etching silicon under the two mediums were studied,and then the differences were compared.As a result,the molten material is easy to be removed in water-assisted micromachining of silicon,which helps to improve the processed surface quality;and the restriction of water improves the impact effect which increases the etching velocity.
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Keywords:
- laser technique /
- water-assisted micromachining /
- excimer laser /
- etching silicon
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