水浴条件下YAG倍频激光切割Si片的实验研究

详细信息

Microcutting Si wafer in water bath by second harmonic output of YAG laser

Shanghai Institute of Optics and Fine Mechanics, the Chinese Academy of Sciences, Shanghai 201800, China

摘要: 用Nd:YAG固体倍频激光器在水中对Si片进行微刻蚀比在空气中产生的飞溅物少。对两种条件下的刻蚀速率、刻槽表面形貌进行了比较。实验结果得到最窄的刻缝宽度小于50μm,表面不平整度小于5μm,为工业用激光切割Si片提供了更好的工艺。
- YAG固体倍频激光 /
- 切割 /
- Si片 /
- 水浴
Abstract: The results are reported that the splashes of microcutting Si wafer by second harmonic output of YAG laser in water bath may be fewer than in air environment.The surface morphology and etching rate for water bath and air environment are compared in detail.The cutting gap as small as 50μm with edge fluctuation less than 5μm is obtained in water bath.This technology may be helpful for industrial applications.
- second harmonic output of YAG laser /
- cutting /
- Si wafer /
- water bath

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