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激光快速熔凝CuCr50触头材料的组织与性能

Structure and properties of CuCr50 prepared by laser fast remelt

  • 摘要: 采用激光快速熔凝技术处理了CuCr50材料的表面,结果表明,该方法可使CuCr50材料表面得到3~5μm的亚晶层,该层孔隙率低,硬度比基体提高近1倍,但电导率变化不大。当其它工艺参数不变时,可通过改变激光功率来获取不同深度的熔池,在熔池与基体之间存在一热影响区,该区的性能界于表层和基体之间,激光表面重熔作为CuCr50触头材料表面强化的工艺是可行的。

     

    Abstract: If laser fast remelt technique is used to prepare CuCr50 surface,a 3~5μm fine-grained layer will generate.The layer has less porosity.The hardness of the surface increases nearly one time than that of the matrix and the conductivity changes little.The thickness of the fine-grained layer can be controlled by laser power while the other operation parameters don't change.There is a heat-influenced layer between the fine-grained layer and the matrix,whose properties is between theirs too.Experiments show that laser fast remelt is useful to increase the hardness of CuCr50 contact material.

     

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