| [1] | EHRFLD W,MUNCHMEYE D.3-dimensionalmicro fabricationg using synchrotron radiation[J].Nulear Instruments and Methods in Physic Research,1991,A303:523～526. |
| [2] | CHEN D.Three-dimensional microstructure machining technologywithout Si[J].Electronic Science and Technology Review,1999(9):32～36(in Chinese). |
| [3] | WEI R X.Relationship between etching identities and laser pulse parameters in excimer direct etching fabrication[J].Laser Technology,2004,28(1):85～87(in Chinese). |
| [4] | SUN K N,XU M,ZHANG G W et al.Bright nickel plating on parts with deep hole[J].Plating and Environment Protection,1995,15(4):3～6(in Chinese). |
| [5] | LOWENHEIM F A.Modern plating[M].Beijing:Machine Industry Publishing Company,1982.344～410(in Chinese). |
| [6] | CHEN H F,JIN W R,QUAN R X.Electroosmotic flow in capillary zone electrophoresis[J].Journal of Analytical Science,1998,14(3):257～262(in Chinese). |
| [7] | LI M H,YUAN Sh P,HUANG W Ch.Fast plating[M].Chengdu:Sichuan Peoples Publish House,1980.30～43,73～77(in Chinese). |
| [8] | XIONG Y,JING T F.A study of jet electrodepositing nanometer crystalline nickel[J].Plating and Finishig,2000,22(5):1～4(in Chinese). |