Research progress of cleaning tiny particles by short-pulsed laser

CHEN Ju-fang; ZHANG Yong-kang; KONG De-jun; YE Xia

Volume 31 Issue 3

May 2010

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Article Navigation > LASER TECHNOLOGY > 2007 > 31(3): 301-305

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Research progress of cleaning tiny particles by short-pulsed laser

1.
School of Mechanical Engineering, Jiangsu University, Zhengjiang 212013, China;
2.
School of Mechanical and Automobile Engineering, Jiangsu Teachers University of Technology, Changzhou 213001, China

Corresponding author: ZHANG Yong-kang, ykzhang@ujs.edu.cn ;
Received Date: 2006-03-31
Accepted Date: 2006-05-16

Abstract

The development of cleaning tiny particle technology by short-pulsed laser is reviewed.At first its research background and basic theoretical model are introduced.Then its applications such as the dry laser cleaning and the steam laser cleaning are described and the influence factors on the cleaning effect are summed up.Finally some predictions of its future development are presented.
- laser technique,
- laser cleaning tiny particle,
- short-pulsed laser,
- summary,

References

[1]	ZHAO Zh M.The application of laser cleaning technology in micro electronics in industry field[J].Cleaning Technology,2004,2(8):29～34(in Chinese).
[2]	ZHENG Y W,LUKYANCHUK B S,LU Y F et al.Dry laser cleaning of particles from solid substrates experiments and theory[J].J A P,2001,90(5):2137～2142.
[3]	TAM A C,LEUNG W P,ZAPKA W et al.Laser-cleaning techniques for removal of surface particulates[J].J A P,1992,71(7):3515～3523.
[4]	LU Y F,SONG W D,LOW T S.Laser cleaning of micro-particles from a solid surface-theory and applications[J].Materials Chemistry and Physics,1998,54(1):181～185.
[5]	FOURRIER T,SCHREMS G,MUHLBERGER T et al.Laser cleaning of polymer surfaces[J].Appl Phys,2001,A72(1):1～6.
[6]	KERRY J D,STUFF M I,HOVUS F E et al.Removal of small particles from surfaces by pulsed laser irradiation.[J].Proc SPIE,1991,1415:211～219.
[7]	LU Y F,ZHENG Y W,SONG W D.Laser induced removal of spherical particles from silicon wafers[J].J A P,2000,87(3):1534～1539.
[8]	SONG W D,HONG M H,LEE S H et al.Real-time monitoring of laser cleaning by an airborne particle counter[J].Applied Surface Science,2003,208(2):306～310.
[9]	DOBLER V,OLTRA R,BOQUILLON J P et al.Surface acceleration during dry laser cleaning of silicon[J].Appl Phys,1999,A69(7):335～337.
[10]	LI J Ch.Calculation of laser diffraction and heat interaction[M].Beijing:Science Press,2001.341～432(in Chinese).
[11]	TAM A C,PARK H K,GRIGOROPOULOS C P.Laser cleaning of surface contaminants[J].Applied Surface Science,1998,127(3):721～725.
[12]	LU Y F,SONG W D,ANG B W et al.A theoretical model for laser removal of particles from solid surfaces[J].Appl Phys,1997,A65(1):9～13.
[13]	LEE J M,WATKINS K G,STEEN W M.Angular laser cleaning for effective removal of particles from a solid surface[J].Appl Phys,2000,A71(6):671～674.
[14]	VEREECKE G,ROHR E,HEYNS M M.Influence of beam incidence angle on dry laser cleaning of surface particles[J].Applied Surface Science,2000,157(1):67～73.
[15]	SONG W D,HONG M H,KOH H L et al.Laser-induced removal of plate-like particles from solid surface[J].Applied Surface Science,2002,186(1):69～74.
[16]	KIM T,LEE J M,CHO S H et al.Acoustic emission monitoring during laser shock cleaning of silicon wafers[J].Optics and Laser in Engineering,2005,43(9):1010～1020.
[17]	LEE S H,PARK J G,LEE J M et al.Si wafer surface cleaning using laser-induced shock wave:a new dry cleaning methodology[J].Surface and Coatings Technology,2003,169(1):178～180.
[18]	LIM H,KIM D.Optical diagnostics for particle-cleaning process utilizing laser-induced shockwave[J].Appl Phys,2004,A79(5):965～968.
[19]	LUK B S,WANG Z B,SONG W D et al.Particle on surface:3-D-effects in dry laser cleaning[J].Appl Phys,2004,A79(4):747～751.
[20]	MOSBACHER M,MUNZER H J,ZIMMERMANN J.Optical field enhancement effects in laser-assisted particle removal[J].Appl Phys,2001,A72(1):41～44.
[21]	ZHENG Y W,LU Y F,SONG W D.Angular effect in laser removal of spherical silica particles from silicon wafers[J].J A P,2001,90(1):59～63.
[22]	MOSBACHER M,CHAOUI N,SIEGEL J et al.A comparison of ns and ps steam laser cleaning of Si surface[J].Appl Phys,1999,A69(7):331～334.
[23]	LU Y F,ZHANG Y,WAN Y H et al.Laser cleaning of silicon surface with deposition of different liquid films[J].Applied Surface Science,1999,138(1):140～144.
[24]	MOSBACHER M,DOBLER V,BONEBERG J et al.Universal threshold for the steam laser cleaning of sub-micron spherical particles from silicon[J].Appl Phys,2000,A70(6):669～672.
[25]	JIN R X,HUAI X L,LIU D Y.The applicability of classical theory for rapid transient explosive boiling[J].Journal of Engineering Thermo Physics,2003,24(6):1013～1015(in Chinese).
[26]	LANG F,MOSBACHER M,LEIDERER P.Near field induced defects and influence of the liquid layer thickness in steam laser cleaning of silicon wafers[J].Appl Phys,2003,A77(1):117～123.
[27]	CAO B Q,ZENG X Y.Review of patents in laser processing in China and America[J].Laser Technology,2004,28(4):346～351(in Chinese).

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通讯作者: 陈斌, bchen63@163.com

1.
沈阳化工大学材料科学与工程学院沈阳 110142

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Research progress of cleaning tiny particles by short-pulsed laser

Corresponding author: ZHANG Yong-kang, ykzhang@ujs.edu.cn;

1. School of Mechanical Engineering, Jiangsu University, Zhengjiang 212013, China;

2. School of Mechanical and Automobile Engineering, Jiangsu Teachers University of Technology, Changzhou 213001, China

Received Date: 2006-03-31

Accepted Date: 2006-05-16

Available Online: 2007-06-25

Abstract: The development of cleaning tiny particle technology by short-pulsed laser is reviewed.At first its research background and basic theoretical model are introduced.Then its applications such as the dry laser cleaning and the steam laser cleaning are described and the influence factors on the cleaning effect are summed up.Finally some predictions of its future development are presented.

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Reference (27)

[1]	ZHAO Zh M.The application of laser cleaning technology in micro electronics in industry field[J].Cleaning Technology,2004,2(8):29～34(in Chinese).
[2]	ZHENG Y W,LUKYANCHUK B S,LU Y F et al.Dry laser cleaning of particles from solid substrates experiments and theory[J].J A P,2001,90(5):2137～2142.
[3]	TAM A C,LEUNG W P,ZAPKA W et al.Laser-cleaning techniques for removal of surface particulates[J].J A P,1992,71(7):3515～3523.
[4]	LU Y F,SONG W D,LOW T S.Laser cleaning of micro-particles from a solid surface-theory and applications[J].Materials Chemistry and Physics,1998,54(1):181～185.
[5]	FOURRIER T,SCHREMS G,MUHLBERGER T et al.Laser cleaning of polymer surfaces[J].Appl Phys,2001,A72(1):1～6.
[6]	KERRY J D,STUFF M I,HOVUS F E et al.Removal of small particles from surfaces by pulsed laser irradiation.[J].Proc SPIE,1991,1415:211～219.
[7]	LU Y F,ZHENG Y W,SONG W D.Laser induced removal of spherical particles from silicon wafers[J].J A P,2000,87(3):1534～1539.
[8]	SONG W D,HONG M H,LEE S H et al.Real-time monitoring of laser cleaning by an airborne particle counter[J].Applied Surface Science,2003,208(2):306～310.
[9]	DOBLER V,OLTRA R,BOQUILLON J P et al.Surface acceleration during dry laser cleaning of silicon[J].Appl Phys,1999,A69(7):335～337.
[10]	LI J Ch.Calculation of laser diffraction and heat interaction[M].Beijing:Science Press,2001.341～432(in Chinese).
[11]	TAM A C,PARK H K,GRIGOROPOULOS C P.Laser cleaning of surface contaminants[J].Applied Surface Science,1998,127(3):721～725.
[12]	LU Y F,SONG W D,ANG B W et al.A theoretical model for laser removal of particles from solid surfaces[J].Appl Phys,1997,A65(1):9～13.
[13]	LEE J M,WATKINS K G,STEEN W M.Angular laser cleaning for effective removal of particles from a solid surface[J].Appl Phys,2000,A71(6):671～674.
[14]	VEREECKE G,ROHR E,HEYNS M M.Influence of beam incidence angle on dry laser cleaning of surface particles[J].Applied Surface Science,2000,157(1):67～73.
[15]	SONG W D,HONG M H,KOH H L et al.Laser-induced removal of plate-like particles from solid surface[J].Applied Surface Science,2002,186(1):69～74.
[16]	KIM T,LEE J M,CHO S H et al.Acoustic emission monitoring during laser shock cleaning of silicon wafers[J].Optics and Laser in Engineering,2005,43(9):1010～1020.
[17]	LEE S H,PARK J G,LEE J M et al.Si wafer surface cleaning using laser-induced shock wave:a new dry cleaning methodology[J].Surface and Coatings Technology,2003,169(1):178～180.
[18]	LIM H,KIM D.Optical diagnostics for particle-cleaning process utilizing laser-induced shockwave[J].Appl Phys,2004,A79(5):965～968.
[19]	LUK B S,WANG Z B,SONG W D et al.Particle on surface:3-D-effects in dry laser cleaning[J].Appl Phys,2004,A79(4):747～751.
[20]	MOSBACHER M,MUNZER H J,ZIMMERMANN J.Optical field enhancement effects in laser-assisted particle removal[J].Appl Phys,2001,A72(1):41～44.
[21]	ZHENG Y W,LU Y F,SONG W D.Angular effect in laser removal of spherical silica particles from silicon wafers[J].J A P,2001,90(1):59～63.
[22]	MOSBACHER M,CHAOUI N,SIEGEL J et al.A comparison of ns and ps steam laser cleaning of Si surface[J].Appl Phys,1999,A69(7):331～334.
[23]	LU Y F,ZHANG Y,WAN Y H et al.Laser cleaning of silicon surface with deposition of different liquid films[J].Applied Surface Science,1999,138(1):140～144.
[24]	MOSBACHER M,DOBLER V,BONEBERG J et al.Universal threshold for the steam laser cleaning of sub-micron spherical particles from silicon[J].Appl Phys,2000,A70(6):669～672.
[25]	JIN R X,HUAI X L,LIU D Y.The applicability of classical theory for rapid transient explosive boiling[J].Journal of Engineering Thermo Physics,2003,24(6):1013～1015(in Chinese).
[26]	LANG F,MOSBACHER M,LEIDERER P.Near field induced defects and influence of the liquid layer thickness in steam laser cleaning of silicon wafers[J].Appl Phys,2003,A77(1):117～123.
[27]	CAO B Q,ZENG X Y.Review of patents in laser processing in China and America[J].Laser Technology,2004,28(4):346～351(in Chinese).

Research progress of cleaning tiny particles by short-pulsed laser

Abstract

References

Proportional views

通讯作者: 陈斌, bchen63@163.com

Proportional views