Experimental study of laser milling of silicon wafer
- Received Date: 2003-01-17
- Accepted Date: 2003-03-25
- Available Online: 2003-09-25
Abstract: Experimental study of laser milling were carried out on the surface of silicon wafer with different YAG lasers and laser processing parameters. The effect of laser processing parameters on the milling surface quality were studied systematically. Different shapes and structures were fabricated on the surface with the optimized procedures.