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Volume 39 Issue 6
Sep.  2015
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Ultra-fast diagnosis of monocrystalline silicon ablated by ns and fs laser

  • Corresponding author: QIU Rong, qiurong@swust.edu.cn
  • Received Date: 2014-09-09
    Accepted Date: 2014-11-03
  • In order to study ultrafast dynamics of high power laser ablation of silica, the dynamic process of monocrystalline silicon ablated by nanosecond (ns) and femtosecond (fs) laser was investigated by the technology of ultrafast time-resolved optical diagnosis. The time-resolved shadowgraphs of the formation and evolution process of plasma expansion, material ejection and shock waves were obtained. For ns laser, material ejection occurs at 200ns ~300ns of delay time with gas-liquid mixture and at 1060ns of delay time with droplet ejection. For fs laser, material ejection occurs at 1ns~2ns of delay time with plasma. The result shows that the dynamic process of laser ablation is significantly different between by fs laser and by ns laser, especially the time of material ejection and the state and size of ejection particles. The results indicate that the process of material ejection induced by ns and fs laser is discontinuous and show that the material ejection is caused by different ablation mechanisms in different time. The results are helpful for the study of interaction mechanism of laser and silica, as well as laser etching monocrystalline silicon.
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Ultra-fast diagnosis of monocrystalline silicon ablated by ns and fs laser

    Corresponding author: QIU Rong, qiurong@swust.edu.cn
  • 1. Joint Laboratory for Extreme Conditions Matter Properties, Southwest University of Science and Technology and Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621010, China

Abstract: In order to study ultrafast dynamics of high power laser ablation of silica, the dynamic process of monocrystalline silicon ablated by nanosecond (ns) and femtosecond (fs) laser was investigated by the technology of ultrafast time-resolved optical diagnosis. The time-resolved shadowgraphs of the formation and evolution process of plasma expansion, material ejection and shock waves were obtained. For ns laser, material ejection occurs at 200ns ~300ns of delay time with gas-liquid mixture and at 1060ns of delay time with droplet ejection. For fs laser, material ejection occurs at 1ns~2ns of delay time with plasma. The result shows that the dynamic process of laser ablation is significantly different between by fs laser and by ns laser, especially the time of material ejection and the state and size of ejection particles. The results indicate that the process of material ejection induced by ns and fs laser is discontinuous and show that the material ejection is caused by different ablation mechanisms in different time. The results are helpful for the study of interaction mechanism of laser and silica, as well as laser etching monocrystalline silicon.

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