[1] KASULKE P,SCHMIDT W,lITERLE L et al.Solder ball bumper SB2-A flexible manufacturing tool for 3-dimensional sensor and microsystem packages[A].Twenty-Third IEEE/CPMT Eletronics Manufacturing Technology Symposium[C].Piscataway,NJ:IEEE,1980.70～75.
[2] LEE J H,PARK D,KIM Y S.Characteristics of the Pb-Sn eutecticsolder bump formed via fluxless laser reflow soldering[J].Journal of electronic materials,2000,29(10):1153～1159.
[3] LEE J H,LEE Y H,KIM Y S.Fluxless laser reflow bumping of Sn-Pb eutectic solder[J].Scripta Materialia,2000,42(8):789～793.
[4] LI M Y,WANG Ch Q,BANG H S et al.Development of a flux-less soldering method by ultrasonic modulated laser[J].Journal of Materials Processing Technology,2005,168(2):303～307.
[5] ANTAL F,BAGGERMAN J,SCHWARZBACH D.Solder-jetted eutectic PbSn bumps for flip-chip[J].IEEE Transactions on Componeets and Packaging manufacturing Technologies,1998,21(4):371～381.
[6] YANG Y S,KIM H Y,CHUN J H.Spreading and solidification of a molten microdrop in the solder jet bumping process[J].IEEE Transactions on Advanced Packaging,2003,26(1):215～221.
[7] HONG S M,KANG Ch S,JUNG J P.Plasma reflow bumping of Sn-3.5 Ag solder for flux-free flip chip package application[J].IEEE Transactions on Advanced Packaging,2004,27(1):90～96.
[8] HONG S M,KANG Ch S.Fluxless solder bumping in flip chip package by plasma reftow[A].IEEE/EMAP Symposium on Elecfronit Materials and Packaging[C].Piscataway,NJ:IEEE,2001.139～145.
[9] TIAN Y H,WANG Ch Q,GE X Sh et al.Intermetallic compounds formation at interface between PBGA,solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes[J].Materials Science and Engineering,2002,B95(3):254～262.
[10] LI X Y,QI X J,ZENG X Y.Establishment and application of temperature field model in laser micro-cladding[J].Laser Technology,2005,29(6):561～564(in Chinese).