[1] CRUZ R, da CRUZ R J A, MAÇAIRA J, et al. Glass-glass laser-assisted glass frit bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(12): 1949-1956. doi: 10.1109/TCPMT.2012.2212195
[2] WU Q, LORENZ N, KEVIN M. Glass frit as a hermetic joining layer in laser based joining of miniature devices[J]. IEEE Transactions on Components and Packaging Technologies, 2010, 33(2): 470-477. doi: 10.1109/TCAPT.2010.2045000
[3] CHEN G Y, HE J, ZHONG P X, et al. Study on the porosity control during laser welding of glass[J]. Laser Technology, 2021, 45(3): 286-291(in Chinese).
[4] SU Sh X, YU Y L, FEI W, et al. Research of characteristics of weld formation of aluminum alloy by high power fiber laser welding[J]. Laser Technology, 2017, 41(3): 322-327 (in Chinese).
[5] BARDIN F, KLOSS S, WANG Ch H, et al. Laser bonding of glass to silicon using polymer for microsystems packaging[J]. Journal of Microelectromechanical Systems, 2007, 16(3): 571-580. doi: 10.1109/JMEMS.2007.896704
[6] RIBEIRO F, MACAIRA J, CRUZ R, et al. Laser assisted glass frit sealing of dye-sensitized solar cells[J]. Solar Energy Materials and Solar Cells, 2012, 96: 43-49. doi: 10.1016/j.solmat.2011.09.009
[7] TAO W, MA Y A, CHEN Y B, et al. The influence of adhesive viscosity and elastic modulus on laser spot weld bonding process[J]. International Journal of Adhesion and Adhesives, 2014, 51: 111-116. doi: 10.1016/j.ijadhadh.2013.12.003
[8] HUANG M H, ZHANG Q M, LV Q T, et al. UV-laser welding process of copper-plated glass[J]. Chinese Journal of Lasers, 2020, 47(10): 1002007(in Chinese). doi: 10.3788/CJL202047.1002007
[9] XIAO Y Y, WANG W, WU X Y, et al. Process design based on temperature field control for reducing the thermal residual stress in glass/glass laser bonding[J]. Optics & Laser Technology, 2017, 91: 85-91. doi: 10.1016/j.optlastec.2016.12.016
[10] PANG J W, WANG Ch, CAI Y K. Research progress of laser processing technology for glass materials[J]. Laser Technology, 2021, 45(4): 417-428(in Chinese).
[11] FU K, LI Y, YIN L Q, et al. Effect of CuO on laser absorption in glass to glass laser bonding[C]//2014 15th International Conference on Electronic Packaging Technology. New York, USA: IEEE, 2014: 484-488.
[12] TIAN R, YIN L Q, LI Y, et al. The effect of glass frit paste levelling property on encapsulation[C]//2018 19th International Conference on Electronic Packaging Technology (ICEPT). New York, USA: IEEE, 2018: 1097-1101.
[13] FU X L, TIAN R, LI Y, et al. Laser bonding of glass and glass with constant temperature output[C]//2018 19th International Confe-rence on Electronic Packaging Technology (ICEPT). New York, USA: IEEE, 2018: 1084-1088.
[14] KIND H, GEHLEN E, ADEN M, et al. Laser glass frit sealing for encapsulation of vacuum insulation glasses[J]. Physics Procedia, 2014, 56: 673-680. doi: 10.1016/j.phpro.2014.08.075
[15] BEDJAOUI M, AMIRAN J, BRUN J. Ultrathin glass to ultrathin glass bonding using laser sealing approach[C]//2019 IEEE 69th Electronic Components and Technology Conference (ECTC). New York, USA: IEEE, 2019: 995-1001.
[16] EMAMI S, MARTINS J, ANDRADE L, et al. Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates[J]. Optics and Lasers in Engineering, 2017, 96: 107-116. doi: 10.1016/j.optlaseng.2017.04.006
[17] PENG G Sh. Laser welding characteristics of aluminum and nickel-base alloys under vacuum environment[D]. Harbin: Harbin Institute of Technology, 2015: 48-54 (in Chinese).
[18] MIAO H, HE Q, ZHANG Sh W, et al. Study on pores control of va-cuum plate glazing by laser sealing[J]. Laser Technology, 2019, 43(1): 38-42 (in Chinese).
[19] LIU Y F, CHEN D E, LIN L W, et al. Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure[J]. Journal of Laser Micro Nanoengineering, 2016, 26: 035018. doi: 10.1088/0960-1317/26/3/035018
[20] LORENZ N, MILLAR S, DESMULLIEZ M, et al. Hermetic glass frit packaging in air and vacuum with localized laser joining[J]. Journal of Laser Micro Nanoengineering, 2011, 21: 045039.