[1] PAN Y, ZHANG H, CHEN J, et al. Millisecond laser machining of transparent materials assisted by nanosecond laser[J]. Optics Express, 2015, 23(2):765-775. doi: 10.1364/OE.23.000765
[2] LI L Q, CHEN Y B, TAO W. Reserch on dual-beam welding characteristics of aluminum alloy[J]. Chinese Journal of Lasers, 2008, 35(11):1783-1788(in Chinese) doi: 10.3788/JCL
[3] FORSMAN A C, BANKS P S, PERRY M D, et al. Doublepulse machining as a techniques for the enhancement of material removal rates in laser machining of metals[J]. Journal of Appllied Physics, 2005, 98(3):033302. doi: 10.1063/1.1996834
[4] WANG X D, MICHALOWSKI A, WALTER D, et al. Laser drilling of stainless steel with nanosecond double-pulse[J]. Optics & Laser Technology, 2009, 41(2):148-153.
[5] LEHANE C, KWOK H S. Enhanced drilling using a dual-pulse Nd:YAG laser[J]. Applied Physics, 2001, A73(1):45-48.
[6] JIAO L G, ZHAO G M, CHEN M S. Simulation of temperature rise of 45# steel target irradiated by combined laser in the two dimensional cases[J]. Infrared and Laser Engineering, 2010, 39(1):42-46(in Chinese).
[7] JIAO L G, ZHAO G M, CHEN M S. Investigation on the irradiation effects of Q235 steel targets by combined laser[J]. Infrared and Laser Engineering, 2011, 40(5):848-852(in Chinese).
[8] XIAO Q, HE H X, XIA H J. Stress simulation on aluminium alloy irradiated by long pulsed laser and continuous wave laser[J].Chinese Journal of Lasers, 2012, 39(11):1103002(in Chinese). doi: 10.3788/CJL
[9] XIAO Q, HE H X, XIA H J.Temprature flied simulation on aluminium alloy irradiated by long pulsed laser and continuous wave laser[J].Chinese Journal of Lasers, 2013, 40(8):0803009(in Chinese). doi: 10.3788/CJL
[10] WANG X, QIN Y, WANG B, et al. Numerical and experimental study of the thermal stress of silicon induced by a millisecond laser[J]. Applied Optics, 2011, 50(21):3725-3732. doi: 10.1364/AO.50.003725
[11] LIM D J, KI H, MAZUMDER J. Mass removal modes in the laser ablation of silicon by a Q-switched diode-pumped solid-state laser (DPSSL)[J]. Journal of Physics, 2006, D39(12):2624-2635.
[12] MASOLIN A, BOUCHARD P O, MARTINI R, et al. Thermo-mechanical and fracture properties in single-crystal silicon[J]. Journal of Materials Science, 2013, 48(3):979-988. doi: 10.1007/s10853-012-6713-7
[13] TAO S, WU B X, ZHOU Y, et al. Thermal modeling and experimental study of infrared nanosecond laser ablation of silicon[J]. Journal of Applied Physics, 2009, 106(12):123507. doi: 10.1063/1.3271413
[14] YAMAGUCHI K, ITAGAKI K. Measurement of high temperature heat content of silicon by drop calorimetry[J]. Journal of Thermal Analysis and Calorimetry, 2002, 69(3):1059-1066. doi: 10.1023/A:1020609517891
[15] WANG X. The thermal and mechanical effects during pulsed laser interaction with semiconductor materials and the application of laser scribing on the CIGS thin film solar cell[D].Nanjing: Nanjing University of Science and Technology, 2013: 49-50(in Chinese).