| [1] | JIA Zh G, KONG D L, L D X, et al.Research progress of activation processes for electroless plating on nonmetal substrates[J].Electroplating & Finishing, 2016, 35(16):866-872(in Chinese). |
| [2] | HE X T, LIU J X, WU Zh Z, et al.Reseach status of laser treatment on plating surface[J].Hot Working Technology, 2011, 40(10):143-146(in Chinese). |
| [3] | LIN Y, LIU Zh H, WANG F, et al.Development of corrosion surface modification technology for magnesium alloys[J].Surface Technology, 2016, 45(4):124-131(in Chinese). |
| [4] | ZHU Y, ZHANG Y, WANG X M, et al.Research progress of laser surface modification in preparation of metal-matrix ceramic coatings[J].Modern Chemical Industry, 2014, 34(10):64-67(in Chinese). |
| [5] | SONG Ch Y, YAN Y F, LI X Q, et al.Study on silver particles obtained by laser-induced deposition as an activator for electroless copper plating on polyester fabric[J].Electroplating & Finishing, 2015, 34(24):1400-1404(in Chinese). |
| [6] | HOU T J, AI J, LIU J G, et al.Selective preparation of metal copper layer on silicate glass by laser surface modification[J].Laser Technology, 2018, 42(2):176-180(in Chinese). |
| [7] | XU J, LIAO Y, ZENG H, et al.Mechanism study of femtosecond laser induced selective metallization (FLISM) on glass surfaces[J].Optics Communications, 2008, 281(13):3505-3509. doi: 10.1016/j.optcom.2008.03.017 |
| [8] | ZHENG J, CHEN C H, LIU J G, et al.Process for producing conductive circuit of printed circuit board by laser induced liquid phase deposition: CN1377220[P]. 2002-10-30(in Chinese). |
| [9] | LU Q H, WANG Zh G, ZHU Z K, et al. Photoselective deposition of copper lines on ABS substrates by electroless plating[J].Functional Materials, 2000, 31(1):95-97(in Chinese). |
| [10] | CHEN D Sh.Method for laser induced selective chemical plating on polyimide film: CN1772948[P]. 2006-05-17(in Chinese). |
| [11] | PING Y Q, JIANG K Y.Experimental studies about purlsed laser modiifed polyurethane surface chemical copperplating without palladium[J].Engineering Plastics Application, 2015, 43(3):54-59(in Chinese). |
| [12] | PAN C T. Selective electroless copper plating micro-coil assisted by 248nm excimer laser[M]. Amsterdam, Netherland:Elsevier Science Ltd, 2004:62-75. |
| [13] | KORDÁS K, REMES J, LEPPÄVUORI S, et al. Laser-assisted selective deposition of nickel patterns on porous silicon substrates[J]. Applied Surface Science, 2001, 178(1):93-97. |
| [14] | WANG X C, ZHENG H Y, LIM G C. Laser induced copper electroless plating on polyimide with Q-switch Nd:YAG laser[J]. Applied Surface Science, 2002, 200(1):165-171. |
| [15] | FENG L, ZHU M B.Quality management of modern electronic assembly[M].Xi'an:Xidian University Press, 2009:84-91(in Chinese). |