| [1] | BOOTH H J.Recent applications of pulsed lasers in advanced materials processing[J].Thin Solid Films,2004,453～454:450～457. |
| [2] | YE Zh H,DONG J X,WEI Y R et al.Beam profile diagnosis technology for excimer laser[J].High Power Laser and Particle Beams,2004,16(5):619～622(in Chinese). |
| [3] | LAZARE S,LOPEZ J,WEISBUCH F.High-aspect-ratio micro-drilling in polymericmaterials with intense KrF laser radiation[J].Appl Phys,1999,A69(S1):1～6. |
| [4] | MA F J,TIAN Y W,HE F et al.Ultra-short pulse laser induced damage in transparent materials[J].Laser Technology,2005,29(5):507～510(in Chinese). |
| [5] | DANEV G,SPASSOVA E,ASSA J.Excimer laser structuring of bulk polyimide material[J].Applied Surface Science,2000,168 (15):162～165. |
| [6] | van STEENBERGE G,GEERINCK P,van PUT S.MT-compatible laser-ablated interconnections for optical printed circuit boards[J].IEEE Journal of Lightwave Technology,2004,22 (9):2083～2090. |
| [7] | GAN E K W,ZHENG H Y,LIM G C.Laser drilling of micro-vias in PCB substrates[R].Piscataway NJ:IEEE,2000.321～326. |
| [8] | SPEIDELL J L.Mask technology for excimer laser projection ablation[J].SPIE,1997,3236:531～543. |
| [9] | WEI R X.Relationship between etching identities and laser pulse parameters in excimer laser direct etching fabrication[J].Laser Technology,2004,28 (1):85～87 (in Chinese). |
| [10] | JIANG Ch,WANG Y Q.Experimental investigation of processing optical glass K9 with KrF excimer laser[J].Electromachining Mould,2003(2):33～35(in Chinese). |