Applications of holographic interferometry in surface mount technology

Wang Weining; Liang Jingming; Zhang Cunlin; Ai Lun; Dai Fulong

In this paper, the applications of holographic interferometry (HI) in surface mount technology are presented. Out of plane deformations of a PLCC-PCB assembly induced by power dissipation are given by using Double exposure HI. To solve the problem of the fringes discontinue between two bodies of surface mount device and PCB, and to further determine the deformations of the SMD leads and solder joint, a "bright" technique is used in Double exposure HI measurements. Real time HI is used to test the whole hard-disk board deformation during power cycling. A-over heat device is found in the defective board. The results show that the HI is a quite effective tool for the studies of thermal mechanical behavior and quality control of SMT products.

1. Department of Physics, Capital Normal University, Beijing, 100037;

2. Department of Physics and Materials Science, City University of Hong Kong, Hong Kong;

3. Tsinghua Univ ersity, Beijing, 100084

Received Date: 1998-10-09

Accepted Date: 1999-01-07

Available Online: 2000-01-25

Abstract: In this paper, the applications of holographic interferometry (HI) in surface mount technology are presented. Out of plane deformations of a PLCC-PCB assembly induced by power dissipation are given by using Double exposure HI. To solve the problem of the fringes discontinue between two bodies of surface mount device and PCB, and to further determine the deformations of the SMD leads and solder joint, a "bright" technique is used in Double exposure HI measurements. Real time HI is used to test the whole hard-disk board deformation during power cycling. A-over heat device is found in the defective board. The results show that the HI is a quite effective tool for the studies of thermal mechanical behavior and quality control of SMT products.

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Reference (8)

[1]	Hall P M,Dudderar T D,Argyle J F. IEEE Trans Components,Hybrids & Manufacturing Technology,1983;6(4):544～552
[2]	Yeh C P.Experimental and Analytical Investigation of Thermally Induced Warpage for PWBs. Proc IEEE 41st Electronic Component Technology Conference, Oakland, CA, 1991
[3]	Hecht E. Optics.Addison-Wesley Publishing Company, Reading, MA, 1987
[4]	Han B,Guo Y,Lim C K et al. Journal of Electronic Packaging, Transaction of the ASME,1993;118:157～163
[5]	Dudderar T D,Hall P M,Gilbert J A. Exp Mach,1985;25(1):95～104
[6]	Wang W N, Leung K M.Reliability Testing of Solder Joints in Surface Mounted Assembly Using Real-time Holographic Interferometry. Proceedings of 45th Electronic Components and Technology Conference, Las Vegas, NV, May 1995:835～840
[7]	Rastogi P K.Holographic Interferometry, Principles and Methods,1994
[8]	Post D,Han B,Ifju P. High Sensitivity Moiré-Experimental Analysis for Mechanics and Materials.Springer-Verlag New York, Inc, 1994:197～198

[1]	Hall P M,Dudderar T D,Argyle J F. IEEE Trans Components,Hybrids & Manufacturing Technology,1983;6(4):544～552
[2]	Yeh C P.Experimental and Analytical Investigation of Thermally Induced Warpage for PWBs. Proc IEEE 41st Electronic Component Technology Conference, Oakland, CA, 1991
[3]	Hecht E. Optics.Addison-Wesley Publishing Company, Reading, MA, 1987
[4]	Han B,Guo Y,Lim C K et al. Journal of Electronic Packaging, Transaction of the ASME,1993;118:157～163
[5]	Dudderar T D,Hall P M,Gilbert J A. Exp Mach,1985;25(1):95～104
[6]	Wang W N, Leung K M.Reliability Testing of Solder Joints in Surface Mounted Assembly Using Real-time Holographic Interferometry. Proceedings of 45th Electronic Components and Technology Conference, Las Vegas, NV, May 1995:835～840
[7]	Rastogi P K.Holographic Interferometry, Principles and Methods,1994
[8]	Post D,Han B,Ifju P. High Sensitivity Moiré-Experimental Analysis for Mechanics and Materials.Springer-Verlag New York, Inc, 1994:197～198

Applications of holographic interferometry in surface mount technology

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References

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