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Volume 30 Issue 6
Sep.  2013
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Experimental research of micromachining silicon by excimer laser ablation in air and under water

  • Corresponding author: SHI Tie-lin, tlshi@public.wh.hb.cn
  • Received Date: 2005-11-22
    Accepted Date: 2006-04-21
  • To investigate the technique of laser etching silicon under different mediums,micromachining of silicon was conducted using a short-pulse(FWHM is 20ns) KrF excimer laserwith energy of 150mJ~250mJ.Laser etching were tested on a silicon workpiece both in air and under water.Based on the results of experiments,basic etching appearance and etching velocities by excimer laser etching silicon under the two mediums were studied,and then the differences were compared.As a result,the molten material is easy to be removed in water-assisted micromachining of silicon,which helps to improve the processed surface quality;and the restriction of water improves the impact effect which increases the etching velocity.
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    CHOO K L,OGAWA Y,KANBARGI G et al.Micromachining of silicon by short-pulse laser ablation in air and under water[J].Materials Science and Engineering,2004,A372 (1~2):145~162.
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    DAMINELLI G,KRUGER J,KAUTEK W.Femtosecond laser interaction with silicon under water confinement[J].Thin Solid Films,2004,467(1~2):334~341.
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    LI Y W,LIU J Zh,LI W X.Study of CO2 laser grooving under water on the outside of a cylinder casing[J].Chinese Journal of Lasers,1999,26(5):455~460(in Chinese).
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    LING L,LOU Q H,LI Sh Zh et al.Microcutting Si wafer in water bath by second harmonic output of YAG laser[J].Laser Technology,2004,28(2):131~133(in Chinese).
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    LIU H P,ZHOU Y H,XIONG L C et al.Experimental study on transverse affect zone in excimer laserdirect etching[J].Laser Technology,2005,29 (2):132~134 (in Chinese).
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    KRUUSING A.Underwater and water-assisted laser processing:part 2——etching,cutting and rarely used methods[J].Optics and Lasers in Engineering,2004,41 (2):329~352.
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    KRUUSING A.Underwater and water-assisted laser processing:part 1——general features,steam cleaning and shock processing[J].Optics and Lasers in Engineering,2004,41 (2):307~327.
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    XU R Q,CHEN X,SHEN Zh H.Abnormal phenomenon of laser drilling a plate underwater[J].Chinese Journal of High Pressure Physics,2004,18(2):130~134(in Chinese).
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    CHEN X,XU R Q,SHEN Zh H et al.Mechanisms of laser processing in water and air[J].Journal of Nanjing University of Science and Technology,2004,28(3):248~252(in Chinese).
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    沈阳化工大学材料科学与工程学院 沈阳 110142

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Experimental research of micromachining silicon by excimer laser ablation in air and under water

    Corresponding author: SHI Tie-lin, tlshi@public.wh.hb.cn
  • 1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China;
  • 2. Department of Electronic Machinery and Transportation Engineering, Guilin University of Electronic Technology, Guilin 541004, China

Abstract: To investigate the technique of laser etching silicon under different mediums,micromachining of silicon was conducted using a short-pulse(FWHM is 20ns) KrF excimer laserwith energy of 150mJ~250mJ.Laser etching were tested on a silicon workpiece both in air and under water.Based on the results of experiments,basic etching appearance and etching velocities by excimer laser etching silicon under the two mediums were studied,and then the differences were compared.As a result,the molten material is easy to be removed in water-assisted micromachining of silicon,which helps to improve the processed surface quality;and the restriction of water improves the impact effect which increases the etching velocity.

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