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Volume 27 Issue 5
Sep.  2013
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Article Navigation >  LASER TECHNOLOGY  > 2003 >  27(5): 460-462,465

Citation:
shu

Experimental study of laser milling of silicon wafer

  • 1.

    National Laboratory of Laser Technology, HUST, Wuhan, 430074;

  • 2.

    Department of Mathematics and Physics, Anhui Institute of Architecture & Industry, Hefei, 230022

  • Received Date: 2003-01-17
    Accepted Date: 2003-03-25
  • Experimental study of laser milling were carried out on the surface of silicon wafer with different YAG lasers and laser processing parameters. The effect of laser processing parameters on the milling surface quality were studied systematically. Different shapes and structures were fabricated on the surface with the optimized procedures.
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  • [1] 黑泽宏.レ一ザ一研究,1998,26(1):33～39.
    [2] 黑部利次.精密工学会,1996,62(1):95～99.
    [3] 李祥友,曾晓雁,刘勇 et al.中国激光,2001,28(12):1125～1128.
    [4] von 奥尔曼 M.激光束与材料相互作用的物理原理及应用.北京:科学出版社,1994:7.
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通讯作者: 陈斌, bchen63@163.com
  • 1. 

    沈阳化工大学材料科学与工程学院 沈阳 110142

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Experimental study of laser milling of silicon wafer

  • 1. National Laboratory of Laser Technology, HUST, Wuhan, 430074;
  • 2. Department of Mathematics and Physics, Anhui Institute of Architecture & Industry, Hefei, 230022
  • Received Date: 2003-01-17
  • Accepted Date: 2003-03-25
  • Available Online: 2003-09-25

Abstract: Experimental study of laser milling were carried out on the surface of silicon wafer with different YAG lasers and laser processing parameters. The effect of laser processing parameters on the milling surface quality were studied systematically. Different shapes and structures were fabricated on the surface with the optimized procedures.

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