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Volume 23 Issue 6
Sep.  2013
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Article Navigation >  LASER TECHNOLOGY  > 1999 >  23(6): 353-355

Citation:
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Improving of surface adhesion quality of glass substrate to photo polymerizated film during the replica procession of optic disk

  • 1.

    Shanghai Institute of Optics & Fine Mechanics, The Chinese Academy of Sciences, Shanghai, 201800

  • Received Date: 1998-06-05
    Accepted Date: 1999-03-10
  • In this paper,the adhesive strength between photopolymerizated film,glass substrate and CD's Ni-Stamper has been measured.We separately use three methods:pre-coating a thin layer of PMMA,SOL-GEL processing,dipping coating a thin layer of α-replaced silicane connective,to improving the adhesive quality of glass substrate' surface and then compare these methods through different facets to select the simplest and most economical technology.A copy of Ni-Stamper of CD is made by this technology,the microstructure of the copied information is given here with SEM.
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  • [1] 干福熹著.数字光盘与光存储技术.上海:上海科学技术出版社,1993
    [2]

    Krongauz V V,Bhemelzes A A.SPIE,1991;1559
    [3]

    Haverkorn H C,Rijsewijk V,Legieiseand P E et al.Philips Tech Rew,1983;40(10):
    [4] 吴森纪著.有机硅及其应用.北京:化学工业出版社,1990
    [5] 普尔克尔 H K著.玻璃镀膜.北京:科学出版社,1988
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    沈阳化工大学材料科学与工程学院 沈阳 110142

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Improving of surface adhesion quality of glass substrate to photo polymerizated film during the replica procession of optic disk

  • 1. Shanghai Institute of Optics & Fine Mechanics, The Chinese Academy of Sciences, Shanghai, 201800
  • Received Date: 1998-06-05
  • Accepted Date: 1999-03-10
  • Available Online: 1999-11-25

Abstract: In this paper,the adhesive strength between photopolymerizated film,glass substrate and CD's Ni-Stamper has been measured.We separately use three methods:pre-coating a thin layer of PMMA,SOL-GEL processing,dipping coating a thin layer of α-replaced silicane connective,to improving the adhesive quality of glass substrate' surface and then compare these methods through different facets to select the simplest and most economical technology.A copy of Ni-Stamper of CD is made by this technology,the microstructure of the copied information is given here with SEM.

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