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Volume 16 Issue 2
Sep.  2013
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Citation:

Investagation of SMT laser soldering quality monitoring method

  • Received Date: 1991-05-07
    Accepted Date: 1991-06-24
  • In this paper, a method, which has been used in real-time monitoring of laser soldering quality, based on the relation between the thermoelectrical potential and temperature of joint face of the jointed materials and the relation between the efficient heating volume (the integral of the part of the interface temperature above the temperature threshold) and the joint area, is presented. The experimental results show that the relation of the thermoelectrical potential of the jointed materials and interface temperature is well linear, the measured efficient heating volume fully shows the condition of the heating and melting of the interface and solder and can be used in monitoring and controlling laser soldering system.
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  • [1] 王春青,钱乙余,姜以宏.电子工艺技术,1989;(3):2-7

    [2] 王春青,仲田周次.ムーザマィクロリルダリング法セそのィングロセス制御.日本溶接学会,溶接学会全国大会讲演概要(第41集),春季全国大会,东京:黑木出版社;1987;10:326-329

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Investagation of SMT laser soldering quality monitoring method

  • 1. Haerbin Institute of Technology

Abstract: In this paper, a method, which has been used in real-time monitoring of laser soldering quality, based on the relation between the thermoelectrical potential and temperature of joint face of the jointed materials and the relation between the efficient heating volume (the integral of the part of the interface temperature above the temperature threshold) and the joint area, is presented. The experimental results show that the relation of the thermoelectrical potential of the jointed materials and interface temperature is well linear, the measured efficient heating volume fully shows the condition of the heating and melting of the interface and solder and can be used in monitoring and controlling laser soldering system.

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