Profilemetry measurement based on wavenumber scanning interferometry

HE Yanmin; XIE Chuangliang; XU Zhuoming; BAO Hong; YE Shuangli; ZHOU Yanzhou

doi:10.7510/jgjs.issn.1001-3806.2016.03.019

In order to measure 3-D profile of a sample with high accuracy, wavenumber-scanning interferometry was used. An optical wedge was used as reference terminal of a Michelson interferometer system. The phases of wedge interference image were extracted by 2-D Fourier transform. The changes of output wavenumber were detected on line. Finally, all the time-resolved interferometry image sequences were sampled by Fourier transform random. The 3-D contour of object surface was restored with high precision. The profile of a sample object was constructed with the resolution of 6.7nm. The proposed method is particularly suitable for quality inspection of mechanical parts.

Profilemetry measurement based on wavenumber scanning interferometry

Corresponding author: BAO Hong, bhong@gdut.edu.cn;

1. Faculty of Automation, Guangdong University of Technology, Guangzhou 510006, China;

2. Institute of Microelectronics and Information Technology, Wuhan University, Wuhan 430072, China

Received Date: 2015-04-14

Accepted Date: 2015-05-12

Available Online: 2016-05-25

Abstract: In order to measure 3-D profile of a sample with high accuracy, wavenumber-scanning interferometry was used. An optical wedge was used as reference terminal of a Michelson interferometer system. The phases of wedge interference image were extracted by 2-D Fourier transform. The changes of output wavenumber were detected on line. Finally, all the time-resolved interferometry image sequences were sampled by Fourier transform random. The 3-D contour of object surface was restored with high precision. The profile of a sample object was constructed with the resolution of 6.7nm. The proposed method is particularly suitable for quality inspection of mechanical parts.

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Reference (15)

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Profilemetry measurement based on wavenumber scanning interferometry

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