Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

FU Xi; ZHANG Fei; JIANG Ming; DUAN Jun; ZENG Xiaoyan

doi:10.7510/jgjs.issn.1001-3806.2014.04.001

In order to study effect of nanosecond laser processing parameters (such as wavelength, laser fluence, scanning speed) and thickness of the copper layer on the processing quality of laser etching copper clad laminate (including depth and roughness), a 50W 1064nm infrared fiber laser and a 10W 355nm ultraviolet solid-state laser were used for etching the copper clad laminate(CCL) in the comparative experiments. The action mechanisms of infrared laser and ultraviolet laser were analyzed. In the experiments, the 1064nm fiber laser with proper process parameters could etch the copper layer entirely and keep epoxy resin board intact. However, for the 355nm laser, the damage to the organic layer was unavoidable because of the high absorptivity to ultraviolet and photochemical effect. Besides, the infrared fiber laser had a higher processing efficiency. Therefore, with characteristics of high stability and stronger integration, 1064nm infrared fiber laser is more adapt to the large-scale industrial processing of CCL.

Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

Corresponding author: DUAN Jun, duans@mail.hust.edu.cn;

1. Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China

Received Date: 2013-09-04

Accepted Date: 2013-09-26

Available Online: 2014-07-25

Abstract: In order to study effect of nanosecond laser processing parameters (such as wavelength, laser fluence, scanning speed) and thickness of the copper layer on the processing quality of laser etching copper clad laminate (including depth and roughness), a 50W 1064nm infrared fiber laser and a 10W 355nm ultraviolet solid-state laser were used for etching the copper clad laminate(CCL) in the comparative experiments. The action mechanisms of infrared laser and ultraviolet laser were analyzed. In the experiments, the 1064nm fiber laser with proper process parameters could etch the copper layer entirely and keep epoxy resin board intact. However, for the 355nm laser, the damage to the organic layer was unavoidable because of the high absorptivity to ultraviolet and photochemical effect. Besides, the infrared fiber laser had a higher processing efficiency. Therefore, with characteristics of high stability and stronger integration, 1064nm infrared fiber laser is more adapt to the large-scale industrial processing of CCL.

HTML

Reference (14)

[1]	ZHANG H W. The principle and technology of modern printed circuit technology[M]. Beijing: China Machine Press, 2012:10-16(in Chinese).
[2]	HIROGAKI T, AOYAMA E, INOUE H, et al. Laser drilling of blind via holes in aramid and glass/epoxy composites for multi-layer printed wiring boards[J]. Applied Science and Manufacturing, 2001, 32(7): 963-968.
[3]	WANG X C, LI Z L, CHEN T, et al. 355nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates[J].Optics and Lasers in Engineering, 2008, 46(5): 404-409.
[4]	YU X F, HE W, WANG Sh X, et al. Research on blind via drilling using UV laser[J]. Printed Circuit Information, 2011(4): 62-66(in Chinese).
[5]	ZHANG F, ZENG X Y, LI X Y, et al. Laser etching and cutting printed circuit board by 355nm and 1064nm diode pumped solid state lasers[J].Chinese Journal of Lasers, 2008, 35(10): 1637-1643 (in Chinese).
[6]	NOWAK M R, ANTON?ZAK A J, KOZIO? P E, et al. Laser prototyping of printed circuit boards [J]. Opto-Electronics Review, 2013, 21(3): 320-325.
[7]	ZHANG F, DUAN J,ZENG X Y, et al. Study of blind holes drilling on flexible circuit board using 355nm UV laser[J]. Chinese Journal of Lasers, 2009, 36(12):3143-3148(in Chinese).
[8]	YAN M Q, ZHU H H, CHEN Z H. Laser microvia process of printed circuit board [J]. Optics Optoelectronic Technology, 2007, 5(3): 37-40(in Chinese).
[9]	CAO Y, LI X Y, CAI Zh X, et al. Research progress of laser micro processing in integrated circuits manufacturing[J]. Optics Optoelectronic Technology, 2006, 4(4): 25-28(in Chinese).
[10]	MOORHOUSE C J, VILLARREAL F, WENDLAND J J, et al. Enhanced peak power CO2 laser processing of PCB materials [J]. Photonic Engineering, 2005, 5827(44): 438-445.
[11]	YUNG K C, MEI S M, YUE T M. A study of the heat affected zone in the UV YAG laser drilling of GFRP materials[J]. Journal of Materials Processing Technology, 2002,122(2/3): 278-285.
[12]	KONG R Z, LIU J Ch, WU Y F, et al. Positioning study in laser corrosion hemisphere platinum resistors[J]. Laser Technology, 2014, 38(3):321-324(in Chinese).
[13]	KONG L R, ZHANG F, DUAN J, et al. Research on water-assisted laser etching of alumina ceramics[J]. Laser Technology, 2014, 38(3):330-334(in Chinese).
[14]	RYTLEWSKI P, MRZ W,?ENKIEWICZ M, et al. Laser induced surface modification of polylactide[J]. Journal of Materials Processing Technology, 2012, 212(8): 1700-1704.

Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

Abstract

References

Proportional views

通讯作者: 陈斌, bchen63@163.com

Proportional views