Research of the technology of laser cutting LCD glass substrates based on thermal cracking method

WANG Xu-huang

doi:10.3969/j.issn.1001-3806.2011.04.009

In order to cut liquid crystal display (LCD) glass substrates with controlled crack,a new method was put forward.Firstly,an initial crack was prepared on the surface of LCD substrates with Nd: YAG laser.Then,the substrate was heated up with CO2 laser and cooled with Ar gas.The effect of laser spot size and the thickness of LCD glass substrates on laser cutting quality was analyzed.The surface and performance of the cutting face after laser treatment was tested by means of scanning electronic microscope (SEM).The cutting quality was compared with the traditional mechanical cutting quality.The results show that there are lots of micro cracks in the substrates cut with traditional mechanical method,however,the laser cutting surface based on thermal cracking method is smooth and flat,no micro cracks exists,and the cutting section-affecting zone is less than 20μm.It is better to cut LCD glass substrates with thermal crack laser cutting method than mechanical cutting method.

Research of the technology of laser cutting LCD glass substrates based on thermal cracking method

Corresponding author: WANG Xu-huang, laser@zjut.edu.cn;

1. Key Laboratory of Equipment and Advanced Manufacturing Technology, Ministry of Education & Zhejiang Province, Zhejiang University of Technology, Hangzhou 310014, China;

2. Research Center of Laser Processing Technology and Engineering, Zhe-jiang University of Technology, Hangzhou 310014, China;

3. College of Science, Zhejiang University of Technology, Hangzhou 310014, China

Received Date: 2010-09-29

Accepted Date: 2010-10-13

Available Online: 2011-07-25

Abstract: In order to cut liquid crystal display (LCD) glass substrates with controlled crack,a new method was put forward.Firstly,an initial crack was prepared on the surface of LCD substrates with Nd: YAG laser.Then,the substrate was heated up with CO2 laser and cooled with Ar gas.The effect of laser spot size and the thickness of LCD glass substrates on laser cutting quality was analyzed.The surface and performance of the cutting face after laser treatment was tested by means of scanning electronic microscope (SEM).The cutting quality was compared with the traditional mechanical cutting quality.The results show that there are lots of micro cracks in the substrates cut with traditional mechanical method,however,the laser cutting surface based on thermal cracking method is smooth and flat,no micro cracks exists,and the cutting section-affecting zone is less than 20μm.It is better to cut LCD glass substrates with thermal crack laser cutting method than mechanical cutting method.

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Reference (20)

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Research of the technology of laser cutting LCD glass substrates based on thermal cracking method

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