半导体晶圆激光切割新技术

黄福民; 谢小柱; 魏昕; 胡伟; 苑学瑞

半导体晶圆激光切割新技术

1.
广东工业大学机电工程学院广州 510006

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术..

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn ;

基金项目:
国家自然科学基金资助项目(50805027)
中图分类号: TG485

Newly developed techniques for laser dicing wafer

1.
Faculty of Eletromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn ;

CLC number: TG485

摘要: 激光切割半导体晶圆具有切槽窄、非接触式加工和加工速度快等特点,但仍然存在材料重凝、热影响区较大和易产生裂纹等问题。为了解决这些问题,分析了问题的成因,并分别从激光器、光学系统和加工介质3个方面详细介绍了一些新型半导体晶圆激光切割技术,阐述其基本原理,分析其优缺点及主要应用和研究领域,为进一步研究和工业化应用提供了技术参考。
- 激光技术 /
- 激光切割 /
- 半导体晶圆 /
- 影响因素 /
- 激光器
Abstract: Laser dicing semiconductor wafer has advantages of narrow kerf,non-contact processing and high dicing velocity etc.However,there still exist some problems,such as redeposition of melting material,large heat affected zone and cracking easily.In order to overcome these problems,the causes were analyzed and a series of newly-developed methods were introduced in detail from three aspects,i.e.,lasers,optical systems and processing mediums.Simultaneously,the basic principles were described.Furthermore,advantages,disadvantages and applications of laser dicing technique were analyzed,which provides valuable technical references for further research and industrial applications.
- laser technique /
- laser dicing /
- semiconductor wafer /
- influencing factors /
- lasers

[1]	MATSUMARU A,TAKATA A,ISHIZAKI K.Advanced thin dicing blade for sapphire substrate[J].Science and Technology of Advanced Materials,2005,6(2):120.
[2]	RAO R,BRADBY J E,WILILAMS J S.Patterning of silicon by indentation and chemical etching[J].Applied Physics Letters,2007,91 (12):123113/1-123113/3.
[3]	SHIUANN L K.Laser as a future direction for wafer dicing:parametric study and quality assessment[C]//31st International Conference on Electronics Manufacturing and Technology.Kuala Lumpur,Malaysia:IEEE,2006:506-509.
[4]	XIE X Zh,HUANG F M,WEIX,et al.Experimental study of laser dicing sapphire substrale by green DPSS laser[J].Proceedings of SPIE,2010,7844:78440T/1-78440T/7.
[5]	KIM D,KIM Y,SEONG K,et al.Evaluation for UV laser dicing process and its reliability for various designs of stack chip scale package[C]//59th Electronic Components and Technology Conference.San Diego,USA:IEEE,2009:1531-1536.
[6]	TOFTNESS R F,BOYLE A,GILLEN D.Laser technology for wafer dicing and microvia drilling for next generation wafers(invited paper)[J].Proceedings of SPIE,2005,5713:54-66.
[7]	LIZOTTE T.Laser dicing of chip scale and silicon wafer scale packages[C]//28th International Electronics Manufacturing Technology Symposium.San Jose,USA:IEEE/CPMT/SEMI(R),2003:1-5.
[8]	ILLY E K,KNOWLES M,GU E,et al.Impact of laser scribing for efficient device separation of LED components[J].Applied Surface Science,2005,249(1/4):354-361.
[9]	LI M W,KEVIN H.Study of silicon micromachining using diodepumped solid-state lasers[J].Processings of SPIE,2004,5339:64-72.
[10]	YOKOTAM A,MATSUO N,KAWAHARA K,et al.Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation[J].Proceedings of SPIE,2002,4637:180-187.
[11]	RICE G,JONES D,KIM K S,et al.Micromachining of gallium nitride,sapphire,and silicon carbide with ultrashort pulses[J].Proceeding of SPIE,2003,5147:299-307.
[12]	CRAWFORD T H R,BOROWIEC A,HAUGEN H K.Femtosecond laser micromachining of grooves in silicon with 800nm pulses[J].Applied Physics,2005,A80(8):1717-1724.
[13]	STOIAN R,ASHKENASI D,ROSENFELD A,et al.Laser ablation of sapphire with ultrashort pulses[J].Proceedings of SPIE,2000,3885:121-131.
[14]	SUDANI N,VENKATAKRISHNAN K,TAN B.Laser singulation of thin wafer:die strength and surface roughness analysis of 80μm silicon dice[J].Optics and Lasers in Engineering,2009,47 (7/8):850-854.
[15]	GU E,JEON C W,CHOI H W,et al.Micromachining and dicing of sapphire,gallium nitride and micro LED devices with UV copper vapour laser[J].Thin Solid Films,2004,453(1):462-466.
[16]	YOSHINO F,SHAH L,FERMANN M,et al.Micromachining with a high repetition rate femtosecond fiber laser[J].Journal of Laser Micro/Nanoengineering,2008,3(3):157-162.
[17]	SHAH L,FERMANN M E.High power femtosecond fiber chirped pulse amplification system for high speed micromachining[J].Journal of Laser Micro/Nanoengineering,2006,1 (3):176-180.
[18]	OHMURA E,FUKUYO F,FUKUMISTU K,et al.Internal modified-layer formation mechanism into silicon with nanosecond laser[J].Journal of Achievements in Materials and Manufacturing Engineering,2006,17 (1/2):381-384.
[19]	OHMURA E,KUMAGAI M,NAKANO M,et al.Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer[J].Journal of Advanced Mechanical Design Systems and Manufacturing,2008,2(4):540-549.
[20]	DELPHINE P,AKOS S,FRANK W,et al.Particle-free semiconductor cutting using the water jet guided laser[J].Proceedings of SPIE,2005,5713:240-246.
[21]	PERROTTET D,HOUSH R,RICHERZHAGEN B,et al.Heat damage-free laser-microjet cutting achieves highest die fracture strength[J].Proceedings of SPIE,2005,5713:285-292.
[22]	TAN B,VENKATAKRISHNAN K.Dual-focus laser micro-machining[J].Journal of Modem Optics,2005,52 (17):2603-2611.
[23]	VENKATAKRISHNAN K,TAN B.Thin silicon wafer dicing with a dual-focused laser beam[J].Journal of Micromechanics and Microengineering,2007,17(12):2505-2515.
[24]	MIGLIORE L.Enhancing silicon cutting performance by shaping the focused beam[J].Proceedings of SPIE,2007,6458:64580W/1-64580W/9.
[25]	MIGLIORE L,LEE K S,JEONG-MOOG K,et al.Advances in laser singulation of silicon[C]// Conference Proceeding of ICALEO.San Jose,USA:Laser Institute of America,2006:237-242.
[26]	OSTENDORF A,KULIK C,BAUER T,et al.Ablation of metals and semiconductors with ultrashort pulsed lasers:improving surface qualities of microcuts and grooves[J].Proceedings of SPIE,2004,5340:153 163.
[27]	KLOTZBACH U,MAELZER S,KUNTZE T,et al.Influence of gas on cutting silicon with solid state laser[J].Proceedings of SPIE,2004,5339:488-493.
[28]	DAMINELLI G,KRUGER J,KAUTEK W.Femtosecond laser interaction with silicon under water confinement[J]. Thin Solid Films,2004,467 (1/2):334 341.
[29]	JANG D,KIM D.Liquid-assisted excimer laser micromaehing for ablation enhancement and debris reduction[J].Journal of Laser Micro/Nanoengineering,2006,1(3):221-225.
[30]	ZHU S,LU Y F,HONG M H.Laser ablation of solid substrates in a water-confined environment[J].Applied Physics Letters,2001,79(9):1396-1398.

[1]	胡乾午 , 杨泰平 , 李鹏 , 曾晓雁 . 金属件的激光自由成型制造及影响因素研究. 激光技术, 2007, 31(4): 403-405,441.
[2]	贾志新 , 黄金刚 , 高坚强 , 房泽旭 , 张亚洲 , 崔子月 . 长脉宽激光切割聚晶立方氮化硼工艺研究. 激光技术, 2017, 41(3): 346-350. doi: 10.7510/jgjs.issn.1001-3806.2017.03.009
[3]	侯红玲 , 彭玉海 , 解玉坤 , 彭凯 , 张晖 . 激光切割对飞机蒙皮疲劳性能的影响分析. 激光技术, 2016, 40(3): 417-421. doi: 10.7510/jgjs.issn.1001-3806.2016.03.025
[4]	张永强 , 吴艳华 , 陈武柱 , 张旭东 . 激光切割光辐射与切割质量关系的研究. 激光技术, 2007, 31(4): 397-399,444.
[5]	贾信庭 , 贺昌玉 , 王又青 . 激光切割系统功率实时控制研究. 激光技术, 2009, 33(2): 145-146,150.
[6]	汪旭煌 , 姚建华 , 周国斌 , 楼程华 , 杨渊思 . 基于热裂法的液晶玻璃基板激光切割技术研究. 激光技术, 2011, 35(4): 472-476. doi: 10.3969/j.issn.1001-3806.2011.04.009
[7]	谢小柱 , 李力钧 , 张屹 , 刘继常 , 鄢锉 . 激光切割金属厚板新技术. 激光技术, 2005, 29(3): 251-254.
[8]	张冲 , 王冠 , 杨志刚 , 刘赞丰 . 脉冲光纤激光切割连杆裂解槽工艺参量优化. 激光技术, 2018, 42(3): 422-426. doi: 10.7510/jgjs.issn.1001-3806.2018.03.025
[9]	晏一菓 , 阳如坤 , 李建相 , 吴学科 , 张屹 . 激光切割锂电池负极极片复合材料的数值模拟. 激光技术, 2019, 43(6): 773-778. doi: 10.7510/jgjs.issn.1001-3806.2019.06.008
[10]	史晓强 . 低碳钢板的激光切割. 激光技术, 1998, 22(6): 343-345.
[11]	鄢锉 , 李力钧 , 李娟 , 谢小柱 , 张屹 . 激光切割板材表面质量研究综述. 激光技术, 2005, 29(3): 270-274.
[12]	齐立涛 , 刘凤聪 , 张耀东 . 266nm紫外固体激光切割碳纤维复合材料的实验研究. 激光技术, 2022, 46(3): 402-407. doi: 10.7510/jgjs.issn.1001-3806.2022.03.017
[13]	周岩 , 刘晓胜 , 陈向阳 , 杨乐民 . 石英晶体激光切割参数建模. 激光技术, 2000, 24(2): 74-78.
[14]	楼祺洪 , 章琳 , 叶震寰 , 董景星 , 魏运荣 . 紫外激光切割Si片的实验研究. 激光技术, 2002, 26(4): 250-251,254.
[15]	刘建华 , 陈一坚 , 段军 , 胡席远 . 激光切割超音速喷嘴设计. 激光技术, 2000, 24(1): 46-50.
[16]	黄文荣 , 徐宾 , 汤光平 , 杨家林 . 大角度斜面激光切割加工的工艺研究. 激光技术, 2001, 25(4): 290-292.
[17]	张奇 , 沈磊 , 何博 . 飞秒激光在金属微加工中的应用. 激光技术, 2021, 45(4): 429-435. doi: 10.7510/jgjs.issn.1001-3806.2021.04.004
[18]	黄开金 , 曾大文 , 谢长生 . 曲率半径和切速对小管径激光切缝宽度的影响. 激光技术, 2000, 24(1): 51-54.
[19]	王春明 , 胡伦骥 , 胡席远 . 国外激光切割实时监测技术的最新进展. 激光技术, 2001, 25(6): 412-417.
[20]	唐代明 , 苟淑云 , 王军 . 低合金相变诱发塑性(TRIP)钢激光焊接的研究进展. 激光技术, 2012, 36(2): 145-150,178. doi: 10.3969/j.issn.1001-3806.2012.02.001

点击查看大图

计量

文章访问数: 4003
HTML全文浏览量: 706
PDF下载量: 1138
被引次数: 0

姓名
邮箱
手机号码
标题
留言内容
验证码

留言板

半导体晶圆激光切割新技术

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术..

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn ;

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn ;

计量

半导体晶圆激光切割新技术

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn;

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术.

English Abstract

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn

全文HTML

目录

留言板

半导体晶圆激光切割新技术

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术..

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn ;

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn ;

计量

出版历程

半导体晶圆激光切割新技术

通讯作者: 谢小柱, xiaozhuxie@gdut.edu.cn;

作者简介: 黄福民(1987- ),男,硕士研究生,研究方向为激光加工技术.

English Abstract

Newly developed techniques for laser dicing wafer

Corresponding author: XIE Xiao-zhu, xiaozhuxie@gdut.edu.cn

全文HTML

目录